Joining to aluminum

Patent metadata

Field	Value
Publication number	US-10065274-B2
Application number	US-201414909888-A
Country	US
Kind code	B2
Filing date	Aug 29, 2014
Priority date	Aug 29, 2013
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

First claim

The invention claimed is:

1. A method of processing an aluminum surface comprising:
contacting the aluminum surface with a flux, wherein the flux comprises:
from 10 to 45% by weight monoethanol amine;
from 15 to 30% by weight triethanol amine;
from 10 to 35% by weight aminoethylethanol amine;
from 5 to 36% by weight ethoxylated tallow amines; and
from 1 to 10% by weight ethoxylated polyamine, and thereafter;

contacting the aluminum surface with a molten liquid comprising tin or tin alloy.

2. The method of claim 1 , further comprising the step of washing the aluminum surface after contacting the aluminum substrate with the molten liquid.

3. The method of claim 1 , wherein the step of contacting the aluminum surface with a flux comprises spraying and/or dipping and/or brushing.

4. The method of claim 1 , wherein the step of contacting the aluminum surface with a molten liquid comprising tin or tin alloy comprises hot air solder levelling and/or wave soldering.

5. The method of claim 1 , wherein the flux comprises:
from 10 to 40 wt. % monoethanol amine;
from 15 to 30 wt. % triethanol amine;
from 10 to 35 wt. % aminoethylethanol amine;
from 5 to 20 wt. % etholoxated tallow amine; and
from 1 to 10 wt. % etholoxated polyamine.

6. The method according to claim 1 , wherein the flux further comprises a surfactant selected from octyl phenol ethoxylates and nonyl phenol ethoxylates.

7. The method according to claim 6 wherein the flux further comprises an activator selected from the group consisting of aluminum chloride, zinc chloride, tin fluoroborate, fluoroboric acid, aminoethyl ethanol amine, etholoxated amines, etholoxated polyamines and mixtures thereof.

8. The method according to claim 7 , wherein the flux comprises:
from 1 to 5% by weight aluminum chloride and/or
from 5 to 15% by weight zinc chloride, and/or
from 5 to 15% by weight fluoroboric acid.

9. The method according to claim 7 wherein the flux further comprises water.

10. The method according to claim 9 , wherein the flux comprises:
from 10 to 40 wt. % monoethanol amine;
from 15 to 30 wt. % triethanol amine;
from 10 to 35 wt. % aminoethylethanol amine;
from 5 to 20 wt. % etholoxated tallow amine;
from 1 to 5 wt. % water;
from 1 to 5 wt. % ammonium chloride;
from 5 to 15 wt. % zinc chloride;
from 5 to 15 wt. % fluoroboric acid,
from 1 to 5 wt. % tin fluoroborate; and
from 1 to 5 wt. % nonyl and/or octyl phenol ethoxylate.

11. The method according to claim 1 further comprising the step of preheating the aluminum surface to between 90° C. and 150° C. prior to contacting the aluminum surface with the flux.

12. The method according to claim 1 , wherein the step of contacting the aluminum surface with the molten liquid is conducted in a nitrogen atmosphere.

Assignees

• Alpha Assembly Solutions Inc

Inventors

• Pandher Ranjit
• Singh Bawa
• Raut Rahul
• Arora Sanyogita
• Bhatkal Ravindra
• Mo Bin

Classifications

• B23K35/025 Primary

  Pastes, creams or slurries · CPC title

• B23K1/012

  Soldering with the use of hot gas · CPC title

• B23K35/3612 Primary

  with organic compounds as principal constituents · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title

• C22C13/00

  Alloys based on tin · CPC title