High-power pulse coating method

Patent metadata

Field	Value
Publication number	US-10060026-B2
Application number	US-201314413480-A
Country	US
Kind code	B2
Filing date	Jun 24, 2013
Priority date	Jul 10, 2012
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

The invention relates to a method for coating substrates by sputtering of target material, the method comprising the following steps: —applying a first sputtering target made of a first material in a coating chamber to a power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm 2 and preferably 500 W/cm 2 ; —applying a second sputtering target made of a second material that is different from the first material in the coating chamber to a power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm 2 and preferably 500 W/cm 2 , characterized in that the first amount of energy differs from the second amount of energy.

First claim

What is claimed is:

1. Method for coating substrates having substrate surfaces to be coated by sputtering of target material, wherein the substrate surfaces are coated by High Power Impulse Sputtering (HIPIMS), the method comprising the following steps:
applying to a first sputtering target made of a first material in a coating chamber a first power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 500 W/cm 2 ;
applying to a second sputtering target made of a second material that is different from the first material in the coating chamber a second power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the first amount of energy differs from the second amount of energy, and wherein the maximum power density exceeds 500 W/cm 2 ,
setting a ratio of reactive gas flow to inert gas flow,
depositing a mixed crystal layer onto the substrate surfaces to be coated by:
applying a first pulse duration to the first sputtering target to operate the first sputtering target at a first operating point within a first zone starting from a point at which the coating rate for the first sputtering target falls from a maximum achievable coating rate and ending at a point at which the coating rate for the first sputtering target is approximately 30% lower than the maximum achievable coating rate; and
applying a second pulse duration to the second sputtering target to operate the second sputtering target at a second operating point within a second zone starting from the point at which the coating rate for the second sputtering target falls from the maximum achievable coating rate and ending at the point at which the coating rate for the second sputtering target is approximately 30% lower than the maximum achievable coating rate,
wherein the first sputtering target and the second sputtering target are operated at the first operating point and at the second operating point independently from one another.

2. Method according to claim 1 , characterized in that the second time interval is chosen to be longer than the first time interval.

3. Method according to claim 1 , characterized in that the first and second time interval is chosen between 10 μs and 100 ms.

4. Method according to claim 3 , characterized in that the first and second time interval is chosen between 50 μs and 5 ms.

5. Method according to claim 1 , characterized in that the first material and the second material comprise elements from the group formed by: the elements titanium, aluminum, silicon, chromium, boron, carbon, elements from the groups 4A, 4B, 4C of the periodic system of elements as well as the combination of two or more of these elements.

6. Method according to claim 1 , characterized in that at the substrates to be coated, a substrate bias is applied at least occasionally synchronous with the first and second power pulses and the substrate bias is selected specifically to the sputtering target.

7. Method according to claim 1 , characterized in that inert gas is used as working gas during the process, wherein the inert gas is used from the group of the elements He, Ne, Ar, Kr or the combination of two or several thereof.

8. Method according to claim 1 , characterized in that during the process reactive gas from the group of the elements or compounds N 2 , O 2 , C 2 H 2 , CH 4 , silane, TMS, CO 2 or the combination of several group members is used at least occasionally.

9. Method according to claim 1 , characterized in that for the deposition of the mixed crystal layer, the targets are operated simultaneously.

10. Method according to claim 1 , characterized in that the substrates are placed in relation to the coating sources in such a manner that the substrate surfaces to be coated are periodically brought past the coating sources, wherein the layer thus generated is deposited not as a homogenous mixed crystal but as a layer formed of several nano-layers, wherein from one nano-layer to the neighboring one the layer composition changes.

Assignees

• Oerlikon Trading Ag
• Oerlikon Surface Solutions Ag Pfaeffikon

Inventors

• Krassnitzer Siegfried
• Kurapov Denis

Classifications

• H01J37/3467 Primary

  Pulsed operation, e.g. HIPIMS · CPC title

• H01J37/3405

  Magnetron sputtering · CPC title

• C23C14/3464

  using more than one target (C23C14/56 takes precedence) · CPC title

• C23C14/345

  using substrate bias · CPC title

• C23C14/3485 Primary

  using pulsed power to the target · CPC title