Electronic device with shield structure

Patent metadata

Field	Value
Publication number	US-10045468-B2
Application number	US-201615271620-A
Country	US
Kind code	B2
Filing date	Sep 21, 2016
Priority date	Nov 20, 2015
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A shield structure including a metallic plate that is disposed between the first electronic component and the second electronic component; a first side wall that encloses at least a portion of the first electronic component, and includes a first portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the first direction; and a second side wall that encloses at least a portion the second electronic component, and includes a second portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the second direction.

First claim

What is claimed is:

1. An electronic device comprising:
a housing including a first face that faces a first direction, and a second face that faces a second direction, the first direction being opposite to the second direction;
a first printed circuit board including a first face facing in the first direction and a second face facing in the second direction;
a second printed circuit board that is disposed between the second face of the housing and the second face of the first printed circuit board, the second printed circuit including a first face facing in the first direction and a second face facing in the second direction;
at least one first electronic component disposed on the second face of the first printed circuit board;
at least one second electronic component disposed on the first face of the second printed circuit board to be adjacent to the first electronic component;
a shield structure electromagnetically shielding the first electronic component and the second electronic component,
wherein the shield structure comprises:
a metallic plate disposed between the first electronic component and the second electronic component;
a first side wall enclosing at least a portion of the first electronic component and including a first portion that is formed by a portion extending from the peripheral edge of the metallic plate and is formed by being bent in the first direction; and
a second side wall enclosing at least a portion of the second electronic component and including a second portion formed by a portion that extending from the peripheral edge of the metallic plate and being formed by being bent in the second direction,

a first frame enclosing at least a portion of the first electronic component; and
a second frame enclosing at least a portion of the second electronic component,
wherein a first face of the metallic plate is in contact with a first face of the first frame and a second face of the metallic plate is in contact with a first face of the second frame, and
wherein the first portion is connected to at least a portion of a side face of the first frame, and the second portion is connected to at least a portion of a side face of the second frame.

2. The electronic device of claim 1 , further comprising:
a frame enclosing at least a portion of the first electronic component,
wherein the first portion of the shield structure is connected to at least a portion of a side face of the frame, and the second portion of the shield structure is connected to at least a portion of a side face of the second printed circuit board.

3. The electronic device of claim 2 , wherein surfaces of the first portion and the second portion have differently textured surfaces.

4. The electronic device of claim 3 , wherein the surface of the first portion has an uneven shape.

5. The electronic device of claim 3 , wherein the surface of the second portion has a surface that has a plurality of protrusions or scratches.

6. The electronic device of claim 1 , wherein the first portion and the second portion are alternately arranged next to one another and may extend in different directions with respect the metallic plate.

7. The electronic device of claim 1 , wherein the size of the metallic plate is equal to or smaller than the size of the second face of the first printed circuit board or the size of the first face of the second printed circuit board.

8. The electronic device of claim 1 , wherein the first portion is formed to have a first height from the metallic plate in the first direction, and
the second portion is formed to have a second height from the metallic plate in the second direction.

9. The electronic device of claim 1 , further comprising:
a flexible printed circuit board that connects the first printed circuit board and the second printed circuit board to each other.

10. The electronic device of claim 1 , wherein the metallic plate includes a conductive film.

11. An electronic device comprising:
a first printed circuit board;
a second printed circuit board that is disposed to face the first printed circuit board;
at least one first electronic component that is disposed on the first printed circuit board;
at least one second electronic component that is disposed on the second printed circuit board while being adjacent to the first electronic component;
a first frame enclosing at least a portion of the first electronic component; and
a shield structure that electromagnetically shields the first electronic component and the second electronic component,
wherein the shield structure includes:
a metallic plate that is disposed between the first electronic component and the second electronic component;
a first portion that extends from the metallic plate in a first direction that is directed to the first printed circuit board; and
a second portion that extends from the metallic plate in a second direction that is opposite to the first direction,
wherein the first portion is connected to at least a portion of a side face of the first frame.

12. The electronic device of claim 11 , wherein the height of the first portion is larger than the height of the first electronic component, and
the height of the second portion is larger than the height of the second electronic component.

13. The electronic device of claim 11 , further comprising:
a second frame that encloses at least a portion of the second electronic component and is connected to the second printed circuit board, and
wherein the second portion is connected to the second frame.

14. The electronic device of claim 13 , wherein the size of the first frame is smaller than the size of the second frame.

15. The electronic device of claim 11 , wherein the second portion is connected to the second printed circuit board.

16. The electronic device of claim 11 , wherein the first portion and the second portion are arranged next to one another in alternating arrangement along a peripheral edge of the metallic plate.

17. The electronic device of claim 11 , wherein the first portion has a first height from the metallic plate in the first direction, and
the second portion is has a second height from the metallic plate in the second direction.

18. The electronic device of claim 11 , further comprising:
a flexible printed circuit board connecting the first printed circuit board and the second printed circuit board to each other.

19. The electronic device of claim 11 , wherein the metallic plate includes conductive film.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Seo Hyun-Min
• Oh Jun-Taek
• Kim Jin-Woo
• Lee So-Young

Classifications

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K7/1427

  Housings · CPC title