Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same

Patent metadata

Field	Value
Publication number	US-10030287-B2
Application number	US-201113577400-A
Country	US
Kind code	B2
Filing date	Feb 8, 2011
Priority date	Feb 8, 2010
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

First claim

What is claimed:

1. A soft dilute copper alloy material, consisting of:
not lower than 5 mass ppm and not higher than 12 mass ppm of sulfur;
not lower than 7 mass ppm and not more than 30 mass ppm of oxygen;
not lower than 10 mass ppm and not higher than 37 mass ppm of titanium; and
a balance consisting of copper and unavoidable impurities,
wherein a softening temperature is 130° C. to 148° C.,
wherein an average crystal grain size is at least 5 μm and not more than 20 μm in a surface layer up to a depth of 50 μm from a surface,
wherein the average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer,
wherein a size of particles precipitated from the titanium, as distributed in the crystal grains, is not more than 1000 nm and a percentage of particles which are not more than 500 nm is not less than 90%, and
wherein a wire rod comprising the soft dilute copper alloy material is drawn into a wire so as to have a conductivity of not less than 102% IACS (International Annealed Copper Standard).

2. The soft dilute copper alloy material according to claim 1 , wherein a crystalline structure of the soft dilute copper alloy material comprises a recrystallized structure.

3. The soft dilute copper alloy material according to claim 1 , wherein the titanium is present precipitated in a crystal grain or at a crystal grain boundary of copper in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S.

4. The soft dilute copper alloy material according to claim 1 , wherein a portion of the sulfur and the titanium includes a compound or an aggregate in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S, and a remaining of the sulfur and the titanium is present in a form of a solid solution.

5. The soft dilute copper alloy material according to claim 3 , the TiO with a size of not more than 200 nm, the TiO 2 with a size of not more than 1000 nm, the TiS with a size of not more than 200 nm, and the Ti—O—S with a size of not more than 300 nm, as distributed in the crystal grains.

6. A soft dilute copper alloy wire, comprising:
the soft dilute copper alloy material according to claim 1 .

7. The soft dilute copper alloy wire according to claim 6 , wherein a softening temperature thereof is 130° C. to 148° C. when having a diameter of 2.6 mm.

8. The soft dilute copper alloy wire according claim 6 , wherein a plated layer is formed on the surface.

9. A soft dilute copper alloy stranded wire, comprising:
a plurality of ones of the soft dilute copper alloy wire according to claim 6 being stranded.

10. A cable, comprising:
the soft dilute copper alloy wire according to claim 6 ; and
an insulation layer around the soft dilute copper alloy wire.

11. A cable, comprising:
the soft dilute copper alloy stranded wire according to claim 9 ; and
an insulation layer around the stranded wire.

12. A coaxial cable, comprising:
a central conductor formed with a plurality of ones of the soft dilute copper alloy wire according to claim 6 being stranded;
an insulation covering formed on an outer periphery of the central conductor;
an outer conductor comprising copper or a copper alloy arranged on an outer periphery of the insulation covering; and
a jacket layer located on an outer periphery of the outer conductor.

13. A composite cable, comprising:
a plurality of ones of the cable according to claim 10 arranged in a shield layer; and
a sheath on an outer periphery of the shield layer.

14. A composite cable, comprising:
a plurality of ones of the coaxial cable according to claim 12 arranged in a shield layer; and
a sheath on an outer periphery of the shield layer.

15. A soft dilute copper alloy sheet, comprising:
the soft dilute copper alloy material according to claim 1 .

16. A soft dilute copper alloy sheet, comprising:
the soft dilute copper alloy material according to claim 1 being shaped and annealed.

17. The soft dilute copper alloy sheet according to claim 16 , wherein a crystalline structure of the soft dilute copper alloy material comprises a recrystallized structure.

18. The soft dilute copper alloy sheet according to claim 17 , wherein a portion of the sulfur and the titanium includes a compound or an aggregate in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S, and a remaining of the sulfur and the titanium is present in a form of a solid solution.

19. The soft dilute copper alloy sheet according to claim 18 , wherein the TiO with a size of not more than 200 nm, the TiO 2 with a size of not more than 1000 nm, the TiS with a size of not more than 200 nm or the Ti—O—S with a size of not more than 300 nm is distributed in a crystal grain.

20. The soft dilute copper alloy material according to claim 1 , wherein an edge of the inner portion is located at the depth of 50 μm from the surface.

21. The soft dilute copper alloy material according to claim 1 , wherein the titanium content is not lower than 10 mass ppm and not higher than 25 mass ppm.

Assignees

• Aoyama Seigi
• Sumi Toru
• Kuroda Hiromitsu
• Sagawa Hideyuki
• Hitachi Metals Ltd

Inventors

• Aoyama Seigi
• Sumi Toru
• Kuroda Hiromitsu
• Sagawa Hideyuki

Classifications

• B21C1/003

  Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• H01B1/026

  Alloys based on copper · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title

• C22C1/10

  Alloys containing non-metals (C22C1/05, C22C1/08 take precedence) · CPC title