Soft dilute-copper alloy wire, soft dilute-copper alloy twisted wire, and insulated wire, coaxial cable, and composite cable using these

Patent metadata

Field	Value
Publication number	US-9734937-B2
Application number	US-201214005224-A
Country	US
Kind code	B2
Filing date	Mar 16, 2012
Priority date	Mar 17, 2011
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

First claim

The invention claimed is:

1. A soft dilute-copper alloy wire, comprising:
a drawn and annealed at 450 ° C. to 500 ° C. soft dilute-copper material consisting of copper, not lower than 2 mass ppm and not higher than 12 mass ppm of sulfur, higher than 2 mass ppm and not higher than 30 mass ppm of oxygen, and not lower than 4 mass ppm and not higher than 55 mass ppm of titanium,
wherein the soft dilute-copper alloy wire further comprises:
an average crystal grain size of not more than 20 μm in a surface layer having a depth of 50 μm from a surface; and
an elongation of not less than 40% after a wire drawing processing at a reduction ratio of 90% and annealing.

2. The soft dilute-copper alloy wire according to claim 1 , wherein the soft dilute-copper alloy wire is not less than 98% IACS in conductivity.

3. The soft dilute-copper alloy wire according to claim 1 , wherein the soft dilute-copper alloy wire further comprises a plating layer formed on a surface thereof.

4. A soft dilute-copper alloy twisted wire, comprising a plurality of ones of the soft dilute-copper alloy wire according to claim 1 that are twisted together.

5. An insulated wire, comprising:
the soft dilute-copper alloy twisted wire according to claim 4 , and
an insulation layer provided therearound.

6. An insulated wire, comprising:
the soft dilute-copper alloy wire according to claim 1 ; and
an insulation layer provided therearound.

7. A composite cable, comprising:
a plurality of ones of the insulated wire according to claim 6 arranged in a shield layer; and
a sheath provided on an outer periphery of the shield layer.

8. A coaxial cable, comprising:
a central conductor formed by twisting together a plurality of ones of the soft dilute-copper alloy wire according to claim 1 ,
an insulation cover formed on an outer periphery of the central conductor;
an outer conductor comprising copper or copper alloy arranged on an outer periphery of the insulation cover; and
a jacket layer provided on an outer periphery thereof.

9. A composite cable, comprising:
a plurality of ones of the coaxial cable according to claim 8 arranged in a shield layer; and
a sheath provided on an outer periphery of the shield layer.

10. The soft dilute-copper alloy wire according to claim 1 , wherein a softening temperature of the soft dilute-copper alloy wire is not more than 148 ° C. when the reduction ratio is 90%.

11. The soft dilute-copper alloy wire according to claim 1 , wherein the titanium is in a range from 4 mass ppm to 37 mass ppm.

12. The soft dilute-copper alloy wire according to claim 1 , wherein the titanium is in a range from 4 mass ppm to 25 mass ppm.

13. The soft dilute-copper alloy wire according to claim 12 , wherein the sulfur is in a range from 3 mass ppm to 12 mass ppm.

14. The soft dilute-copper alloy wire according to claim 13 , wherein the oxygen is in a range from 7 mass ppm to 8 mass ppm.

15. The soft dilute-copper alloy wire according to claim 1 , wherein the average crystal grain size is more than 5 μm.

16. The soft dilute-copper alloy wire according to claim 1 , wherein the soft dilute-copper alloy wire is not less than 102% IACS in conductivity.

17. The soft dilute-copper alloy wire according to claim 1 , wherein the sulfur is in a range from 3 mass ppm to 12 mass ppm.

18. The soft dilute-copper alloy wire according to claim 1 , wherein the oxygen is in a range from 7 mass ppm to 8 mass ppm.

Assignees

• Aoyama Seigi
• Sumi Toru
• Kuroda Hiromitsu
• Sagawa Hideyuki
• Hitachi Metals Ltd

Inventors

• Aoyama Seigi
• Sumi Toru
• Kuroda Hiromitsu
• Sagawa Hideyuki

Classifications

• C22C9/00

  Alloys based on copper · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• C22C1/02

  by melting {(C22C1/1036 takes precedence)} · CPC title

• H01B7/04 Primary

  Flexible cables, conductors, or cords, e.g. trailing cables · CPC title