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Sagawa Hideyuki patents

Sagawa Hideyuki holds 4 patents in our database, with recent filings and technology areas summarized below.

Company patent statistics
Metric	Value
Total patents	4
Recent patents	0
First publication	Jan 12, 2016
Latest publication	Jul 24, 2018

Filing trend

Year-over-year patent counts for this assignee.

Filing activity appears to be declining based on the most recent years.

Patents filed per year
Year	Patents
2016	1
2017	2
2018	1

Browse patents by year
Year	Patents
2016	1
2017	2
2018	1

Recent patents

Latest publications where this party is an assignee.

Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same
US-10030287-B2 · Jul 24, 2018 · US
Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement
US-9805836-B2 · Oct 31, 2017 · US
Soft dilute-copper alloy wire, soft dilute-copper alloy twisted wire, and insulated wire, coaxial cable, and composite cable using these
US-9734937-B2 · Aug 15, 2017 · US
Weldment
US-9234263-B2 · Jan 12, 2016 · US

Notable patents

Representative or frequently cited publications from precomputed assignee stats.

Technology areas

Mapped technology topics for this assignee.

Company technology slices
Technology	Patents
Chemistry & Metallurgy	4
Operations & Transport	3
Electricity	3
Cross-Sectional Technologies	1