Audio/Video cable

US9293231B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9293231-B2
Application numberUS-201414328958-A
CountryUS
Kind codeB2
Filing dateJul 11, 2014
Priority dateOct 20, 2010
Publication dateMar 22, 2016
Grant dateMar 22, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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An audio/video cable includes an insulated layer including a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti.

First claim

Opening claim text (preview).

What is claimed is: 1. An audio/video cable, comprising: an insulated layer comprising a conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof, wherein the conductor comprises a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance, wherein the soft dilute copper alloy material comprises a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains, wherein the soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti, and wherein the Ti includes TiO of not more than 200 nm in size, TiO 2 of not more than 1000 nm in size, TiS of not more than 200 nm in size, or a compound in a form of Ti—O—S of not more than 300 nm in size. 2. The audio/video cable according to claim 1 , wherein the surface layer comprises a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm. 3. The audio/video cable according to claim 1 , wherein an electrical conductivity of the soft dilute copper alloy material is not lower than 102% IACS (International Annealed Copper Standard). 4. The audio/video cable according to claim 3 , wherein the soft dilute copper alloy material includes not less than 3 and not more than 12 mass ppm of sulfur, and not less than 4 and not more than 25 mass ppm of Ti. 5. The audio/video cable according to claim 3 , wherein the soft dilute copper alloy material has a softening temperature of not more than 148° C. 6. The audio/video cable according to claim 5 , wherein the soft dilute copper alloy material includes a dispersed particle size that is not more than 500 nm in not less than 90% of particles. 7. The audio/video cable according to claim 1 , wherein the soft dilute copper alloy material includes not less than 3 and not more than 12 mass ppm of sulfur, and not less than 4 and not more than 25 mass ppm of Ti. 8. An audio/video cable, comprising: a plurality of insulated wires each comprising a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof; and a jacket covering a periphery thereof, wherein the copper conductor comprises a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance, wherein the soft dilute copper alloy material comprises a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains, wherein the soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti, and wherein the Ti includes TiO of not more than 200 nm in size, TiO 2 of not more than 1000 nm in size, TiS of not more than 200 nm in size, or a compound in a form of Ti—O—S of not more than 300 nm in size. 9. The audio/video cable according to claim 8 , wherein the surface layer comprises a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm. 10. The audio/video cable according to claim 8 , wherein an electrical conductivity of the soft dilute copper alloy material is not lower than 102% IACS (International Annealed Copper Standard). 11. The audio/video cable according to claim 10 , wherein the soft dilute copper alloy material includes not less than 3 and not more than 12 mass ppm of sulfur, and not less than 4 and not more than 25 mass ppm of Ti. 12. The audio/video cable according to claim 10 , wherein the soft dilute copper alloy material has a softening temperature of not more than 148° C. 13. The audio/video cable according to claim 10 , wherein the soft dilute copper alloy material includes a dispersed particle size that is not more than 500 nm in not less than 90% of particles. 14. The audio/video cable according to claim 8 , wherein the soft dilute copper alloy material includes not less than 3 and not more than 12 mass ppm of sulfur, and not less than 4 and not more than 25 mass ppm of Ti.

Assignees

Inventors

Classifications

  • H01B1/026Primary

    Alloys based on copper · CPC title

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What does patent US9293231B2 cover?
An audio/video cable includes an insulated layer including a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized struct…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01B1/026. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).