Method and device for bonding substrates

Patent metadata

Field	Value
Publication number	US-10014193-B2
Application number	US-201415110417-A
Country	US
Kind code	B2
Filing date	Feb 3, 2014
Priority date	Feb 3, 2014
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.

First claim

Having described the invention, the following is claimed:

1. A device for bonding a first substrate to a second substrate, the device comprising:
a first heating system having a first heating surface that provides heat by infrared radiation;
a second heating system having a second heating surface that provides heat by infrared radiation;
a receiving system for receiving a substrate stack comprised of (i) a first substrate having a first contact surface and a first surface facing away from the first contact surface and (ii) a second substrate having a second contact surface and a second surface facing away from the second contact surface, the first and second substrates aligned on the first and second contact surfaces,
wherein
the receiving system is arranged between the first heating surface of the first heating system and the second heating surface of the second heating system, the first and second substrates respectively spaced from the first and second heating surfaces by separation distances A and B,
the first heating surface faces the first surface of the first substrate, and
the second heating surface faces the second surface of the second substrate,

drive means for changing the separation distances A and B;
a force actuator for applying pressure to the first and second surfaces of the substrate stack to form a bond between the first contact surface of the first substrate and the second contact surface of the second substrate; and
a control system for controlling operation of the first heating system, the second heating system, the drive means, and the force actuator, said control system operable in
(i) a heating mode to heat the first and second substrates, wherein the control system controls the drive means to maintain the separation distances A and B such that A>0 μm and B>0 μm, and independently regulate the first and second heating systems in accordance with parameter data to heat the first and second substrates such that a thermal expansion of the first substrate and a thermal expansion of the second substrate are substantially the same during the heating mode,
and
(ii) a bonding mode to form a permanent bond between the first and second substrates by pressurization of the substrate stack, wherein the control system controls the drive means to approach the substrate stack towards the first and second heating surfaces by reducing the separation distances A and B to 0 μm, and controls the force actuator to apply pressure to the first and second surfaces of the substrate stack to form the bond between the first contact surface of the first substrate and the second contact surface of the second substrate.

2. The device according to claim 1 , wherein the first heating surface and/or the second heating surface are formed by studs with flow channels running between the studs for pressurization with a gas.

3. The device according to claim 2 , wherein the flow channels are surrounded by an arm for sealing the flow channels with respect to the first and/or second substrate.

4. The device according to claim 3 , wherein the arm has an opening for controlled discharge of gas.

5. The device according to claim 3 , wherein the arm is a circular arm.

6. The device according to claim 2 , wherein the flow channels are flushed with gas.

7. The device according to claim 1 , wherein, the control system independently regulates the first and second heating systems in accordance with the parameter data by (i) heating the first heating surface to a different temperature than the second heating surface and/or (ii) maintaining different separation distances A and B.

8. The device according to claim 1 , wherein the parameter data is indicative of: type of material of the first and second substrates, thermal expansion coefficients of the first and second substrates, thickness of the first and second substrates, heating temperature of the first and second heating surfaces, and/or bonding method.

9. A method for bonding a first substrate to a second substrate, the method comprising:
providing a substrate stack comprised of (i) a first substrate having a first contact surface and a first surface facing away from the first contact surface and (ii) a second substrate having a second contact surface and a second surface facing away from the second contact surface, said substrate stack aligned on the first and second contact surfaces;
arranging the substrate stack between a first heating surface of a first heating system and a second heating surface of a second heating system by use of a receiving system, wherein the first heating surface faces the first surface of the first substrate, and the second heating surface faces the second surface of the second substrate, the first and second substrates respectively spaced from the first and second heating surfaces by separation distances A and B;
heating the first and second substrates in a heating mode wherein the separation distances A and B are maintained such that A>0 μm and B>0 μm, said heating mode including independent regulation of the first and second heating systems in accordance with parameter data to heat the first and second substrates such that a thermal expansion of the first substrate and a thermal expansion of the second substrate are substantially the same during the heating mode; and
bonding the first and second substrates in a bonding mode to form a permanent bond between the first and second substrates by pressurization of the substrate stack, said bonding mode including:
approaching the substrate stack towards the first and second heating surfaces by use of drive means to reduce the separation distances A and B to 0 μm, and
applying pressure to the first and second surfaces of the substrate stack by use of a force actuator to form the bond between the first contact surface of the first substrate and the second contact surface of the second substrate.

10. The method according to claim 9 , wherein the method further comprises:
preheating the substrate stack before arranging the substrate stack between the first and second heating surfaces.

11. The method according to claim 10 , wherein the method further comprises preheating the substrate stack outside a bonding chamber of a bonding system.

12. The method according to claim 11 , wherein the bonding system surrounds, vacuumably, the first and second heating systems.

13. The method according to claim 9 , wherein the approaching of the substrate stack towards the first and second heating surfaces is carried out symmetrically with respect to the substrate stack.

14. The method according to claim 13 , wherein the approaching of the substrate stack towards the first and second heating surfaces is carried out symmetrically to the respective first and second surfaces of the first and second substrates and/or the respective first and second contact surfaces of the first and second substrates and/or at the same temperature of the first and second heating surfaces.

15. The method according to claim 9 , wherein the first and second heating surfaces are larger than the respective first and second surfaces of the substrate stack that respectively face the first and second heating surfaces.

16. The method according to claim 9 , wherein the first heating surface or the second heating surface is not moved during the approaching.

17. The method according to claim 9 , wherein the method further comprises:
controlling the first and second heating systems during the heating and the approaching such that at least during a substantial majority of a time period for approaching, the difference b

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Lindner Friedrich Paul

Classifications

• H10P72/7602

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• H10P72/0602

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• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title