Ceramic package with brazing material near seal member

Patent metadata

Field	Value
Publication number	US-10014189-B2
Application number	US-201615166491-A
Country	US
Kind code	B2
Filing date	May 27, 2016
Priority date	Jun 2, 2015
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

First claim

What is claimed is:

1. A ceramic package comprising:
a ceramic substrate having a surface;
a metallization layer disposed along an outer periphery of a predetermined region on the surface of the ceramic substrate;
a first plating layer disposed on the metallization layer;
a brazing material layer disposed on the metallization layer with the first plating layer interposed therebetween; and
a seal member joined on the metallization layer via the brazing material layer, wherein
in at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned at least 0.02 mm nearer to the seal member than an end of the metallization layer.

2. The ceramic package according to claim 1 , wherein at least a portion of the first plating layer that is interposed between the metallization layer and the brazing material layer has a thickness of not less than 1.5 μm and not greater than 5 μm.

3. The ceramic package according to claim 1 , further comprising a second plating layer formed on the brazing material layer such that at least one of an outer peripheral end and an inner peripheral end of the second plating layer is in contact with the first plating layer, and at least a portion of the second plating layer that is located on the brazing material layer has a thickness of not less than 1.5 μm and not greater than 5 μm.

4. The ceramic package according to claim 1 , wherein
a wall portion defines a cavity that opens in one direction at the surface of the ceramic substrate, the wall portion surrounding the predetermined region, and
the metallization layer is formed on an upper end surface of the wall portion surrounding the cavity.

5. The ceramic package according to claim 1 wherein in at least one of the outer peripheral portion and the inner peripheral portion of the brazing material layer, the brazing material layer is in contact with a bottom surface of the seal member and a lower end of a side surface of the seal member.

6. The ceramic package according to claim 5 , wherein in a cross-section along a lamination direction of the brazing material layer and the metallization layer, a contour line of at least one of the outer peripheral portion and the inner peripheral portion of the brazing material layer has an end portion forming a curved line that extends downward from the side surface of the seal member and is convex downward.

7. A method for producing the ceramic package according to claim 1 , the method comprising:
a metallization layer forming step of forming the metallization layer along the outer periphery of the predetermined region on the surface of the ceramic substrate;
a first plating step of forming the first plating layer on the metallization layer;
a brazing material layer forming step of forming the brazing material layer on the metallization layer via the first plating layer;
a joining step of brazing the seal member to the metallization layer via the brazing material layer;
a second plating step of forming a second plating layer on the brazing material layer after the joining step; and
a heating step of heating the ceramic substrate at a temperature of 500° C. or higher after the second plating step.

8. The method according to claim 7 , further comprising an end adjusting step of processing the end of the brazing material layer before the second plating step such that at least one of an outer peripheral end and an inner peripheral end of the brazing material layer is positioned at least 0.02 mm inwardly away from a respective outer peripheral end or an inner peripheral end of the metallization layer.

Assignees

• Ngk Spark Plug Co

Inventors

• Suzuki Toshio
• Kanayama Masami
• Hattori Akiyoshi
• Kitou Masanori

Classifications

• H10W76/60

  Seals · CPC title

• H10W76/134

  having other interconnections parallel to the conductive base · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W95/00 Primary

  Packaging processes not covered by the other groups of this subclass · CPC title