Electronic component housing package and electronic device

Patent metadata

Field	Value
Publication number	US-9640452-B2
Application number	US-201414787496-A
Country	US
Kind code	B2
Filing date	Sep 25, 2014
Priority date	Sep 25, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.

First claim

What is claimed is:

1. An electronic component housing package comprising:
a metal base plate having a mount region on a top surface where an electronic component is mounted;
a metal frame body placed on the top surface of the metal base plate so as to surround the mount region, the metal frame body comprising a plurality of side wall parts including a pair of first side wall parts disposed facing each other so as to place the mount region between the pair of first side wall parts and a second side wall part disposed so as to connect end portions of the pair of first side wall parts, and comprising a cutout extending from the second side wall part to the pair of first side wall parts; and
an input/output member bonded to the cutout via a brazing material, the input/output member comprising protruding parts inward of the pair of first side wall parts and the second side wall part and outward of the second side wall part and a plurality of wiring conductors to be electrically connected to the electronic component on the protruding parts;
the input/output member including a portion which is bonded to one of the pair of first side wall parts, a top surface of the portion having a narrow part having a narrow width,
the narrow part being formed by forming a recessed groove provided in a curved shape extending vertically in an upper end of a wall surface of the input/output member, a part of the plurality of wiring conductors being disposed in two rows from a bottom surface of the recessed groove toward end faces of the protruding parts.

2. The electronic component housing package according to claim 1 , wherein the recessed groove is provided on an inner wall surface of the input/output member.

3. The electronic component housing package according to claim 1 , wherein the recessed groove is provided on the each wall surface which is bonded to the pair of first side wall parts.

4. The electronic component housing package according to claim 3 , wherein the recessed grooves are provided on wall surfaces which are bonded to the first side wall parts and are equidistant from the second side wall part.

5. An electronic device comprising:
the electronic component housing package described in claim 1 ;
an electronic component mounted in the mount region of the electronic component housing package and connected to the wiring conductors via conductors; and
a lid bonded to the top surface of the frame body to seal the electronic component.

Assignees

• Kyocera Corp

Inventors

• Tsujino Mahiro
• Sakumoto Daisuke

Classifications

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W70/20

  Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40) · CPC title

• H10W76/134 Primary

  having other interconnections parallel to the conductive base · CPC title

• H01S5/02216

  Butterfly-type, i.e. with electrode pins extending horizontally from the housings · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title