Ceramic package, electronic component device, and method for manufacturing the electronic component device

Patent metadata

Field	Value
Publication number	US-9490772-B2
Application number	US-201615060747-A
Country	US
Kind code	B2
Filing date	Mar 4, 2016
Priority date	Mar 11, 2015
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A ceramic package includes a package body made of a ceramic and including a pair of surfaces, and side surfaces, disposed between four sides of one of the surfaces and four sides of the other surface; a cavity that has an opening in the surface of the package body; a metalizing layer disposed over the surface of the package body surrounding the opening of the cavity; and a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween. The surface surrounding the opening of the cavity includes pairs of opposing side portions and each side portion of at least one of the pairs has a recessed portion in a middle portion of the side portion and a pair of flat portions on respective sides of the recessed portion.

First claim

What is claimed is:

1. A ceramic package comprising:
a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan, and side surfaces disposed between four edges of the top surface and four edges of the bottom surface, the package body defining a cavity that has an opening in at least one of the top surface and the bottom surface of the package body, the opening rectangular when viewed in a plan;
a metalizing layer disposed over the at least one of the top surface and the bottom surface of the package body, the metalizing layer surrounding the opening of the cavity and having a rectangular frame shape when viewed in a plan; and
a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween,
wherein the at least one of the top surface and the bottom surface of the package body includes pairs of opposing side portions surrounding the opening of the cavity and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion.

2. The ceramic package according to claim 1 , wherein the cavity is not open in one of the top surface or the bottom surface of the package body, and external connection terminals are disposed at or around four corner portions of the one of the top surface or the bottom surface of the package body in which the cavity is not open.

3. The ceramic package according to claim 1 , wherein each of the recessed portions has a bottom surface that is horizontal in a side view and each of the flat portions is horizontal in a side view.

4. A ceramic package comprising:
a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan, and side surfaces disposed between four edges of the top surface and four edges of the bottom surface, the package body defining a cavity that has an opening in at least one of the top surface and the bottom surface of the package body, the opening rectangular when viewed in a plan;
a metalizing layer disposed over the at least one of the top surface and the bottom surface of the package body, the metalizing layer surrounding the opening of the cavity and having a rectangular frame shape when viewed in a plan; and
a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween,
wherein the metalizing layer includes pairs of opposing side portions and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion.

5. The ceramic package according to claim 4 , wherein a number of unit metalizing layers constitutes the recessed portion of each side portion of the metalizing layer and a larger number of unit metalizing layers constitutes the flat portions of each side portion of the metalizing layer.

6. The ceramic package according to claim 4 , wherein upper surfaces of the flat portions of each side portion of the metalizing layer are located higher than a bottom surface of the recessed portion of the side portion of the metalizing layer.

7. A ceramic package comprising:
a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan;
a metalizing layer disposed along four sides of at least one of the top surface and the bottom surface of the package body, the metalizing layer having a rectangular frame shape when viewed in a plan; and
a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween, and the metal frame defining a cavity,
wherein the package body includes pairs of opposing side portions and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion, or
wherein the metalizing layer includes pairs of opposing side portions and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion.

8. An electric component device comprising:
a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan, and side surfaces disposed between four edges of the top surface and four edges of the bottom surface, the package body defining a cavity that has an opening in at least one of the top surface and the bottom surface of the package body, the opening rectangular when viewed in a plan;
a metalizing layer disposed over the at least one of the top surface and the bottom surface of the package body, the metalizing layer surrounding the opening of the cavity and having a rectangular frame shape when viewed in a plan;
a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween; and
a metal lid joined to an upper surface of the metal frame,
wherein the at least one of the top surface and the bottom surface of the package body includes pairs of opposing side portions surrounding the opening of the cavity and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion, or
wherein the metalizing layer includes pairs of opposing side portions and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion.

9. A method for manufacturing the electronic component device according to claim 8 , the method comprising:
a step of preparing the package body defining the cavity;
a step of disposing the metalizing layer over the at least one of the top surface and the bottom surface of the package body with the metalizing layer surrounding the opening of the cavity and having a rectangular frame shape when viewed in a plan;
a step of joining the metal frame to the upper surface of the metalizing layer with the brazing filler metal layer interposed therebetween; and
a step of joining the metal lid to the upper surface of the metal frame,
wherein, in the step of preparing the package body, for at least one of the pairs of opposing side portions surrounding the opening of the cavity, the recessed portion is formed in the middle portion of each side portion of the pair and a flat portion is formed at each end of the recessed portion, or
wherein, in the step of disposing the metalizing layer, for at least one of the pairs of opposing side portions of the metalizing layer, the recessed portion is formed in the middle portion of each side portion of the pair and a flat portion is formed at each end of the recessed portion.

10. An electric component device comprising:
a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan;
a metalizing layer disposed along four sides of at least one of the top surface and the bottom surface of the package body, the metalizing layer having a rectangular frame shape when viewed in a plan;
a metal frame joined to an upper surface of the metalizing layer with a brazing f

Assignees

• Ngk Spark Plug Co

Inventors

• Hasegawa Masami

Classifications

• H10W76/60

  Seals · CPC title

• H10W76/12 Primary

  characterised by their shape · CPC title

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/1014

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title