Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device
US-11264242-B2 · Mar 1, 2022 · US
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Zhou Yunpeng patents
Zhou Yunpeng is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zhou Yunpeng |
| Total patents | 4 |
| First publication | Oct 22, 2020 |
| Latest publication | Mar 1, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor wafer, bonding structure and wafer bonding method
US-11069647-B2 · Jul 20, 2021 · US
Method And Apparatus For Determining Expansion Compensation In Photoetching Process, And Method For Manufacturing Device
US-2021035805-A1 · Feb 4, 2021 · US
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method
US-2020335473-A1 · Oct 22, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Wuhan Xinxin Semiconductor Mfg | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 4 |
| H10W72/952 | 4 |
| H10W46/301 | 4 |
| H10W80/312 | 4 |
| H10W80/327 | 4 |