Semiconductor package structure
US-10032692-B2 · Jul 24, 2018 · US
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Yee Abraham patents
Yee Abraham is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yee Abraham |
| Total patents | 4 |
| First publication | Mar 19, 2015 |
| Latest publication | Jul 24, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
US-9760132-B2 · Sep 12, 2017 · US
Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
US-9716051-B2 · Jul 25, 2017 · US
Stiffening electronic packages
US-2015077918-A1 · Mar 19, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nvidia Corp | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 4 |
| H10W90/701 | 4 |
| H10W70/635 | 4 |
| H10W90/734 | 3 |
| H10W74/15 | 3 |