Device-Level Interconnects for Stacked Transistor Structures and Methods of Fabrication Thereof
US-2025351506-A1 · Nov 13, 2025 · US
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Yang Liang-Yueh Ou patents
Yang Liang-Yueh Ou is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Liang-Yueh Ou |
| Total patents | 7 |
| First publication | Dec 8, 2015 |
| Latest publication | Nov 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Device-Level Interconnects for Stacked Transistor Structures and Methods of Fabrication Thereof
US-2024413211-A1 · Dec 12, 2024 · US
Methods for forming contact plugs with reduced corrosion
US-12068197-B2 · Aug 20, 2024 · US
Methods for Forming Contact Plugs with Reduced Corrosion
US-2021257254-A1 · Aug 19, 2021 · US
Systems and methods of compensating for filling material losses in electroplating processes
US-9632498-B2 · Apr 25, 2017 · US
Electro chemical plating process
US-9476135-B2 · Oct 25, 2016 · US
Metal cap apparatus and method
US-9209073-B2 · Dec 8, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 8 |
| Taiwan Semiconductor Mfg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/033 | 5 |
| H10P14/47 | 4 |
| H10W20/056 | 4 |
| H01L21/76877 | 4 |
| H01L21/2885 | 4 |