Power device integration on a common substrate
US-2023420497-A1 · Dec 28, 2023 · US
This page is not indexed by search engines while we improve data quality.
Yang Boyi patents
Yang Boyi is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Boyi |
| Total patents | 12 |
| First publication | Aug 9, 2016 |
| Latest publication | Dec 28, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Power device integration on a common substrate
US-11791377-B2 · Oct 17, 2023 · US
Power device integration on a common substrate
US-2022208964-A1 · Jun 30, 2022 · US
Power device integration on a common substrate
US-11302775-B2 · Apr 12, 2022 · US
Power device integration on a common substrate
US-2019245034-A1 · Aug 8, 2019 · US
Power device on bulk substrate
US-10290702-B2 · May 14, 2019 · US
Power device integration on a common substrate
US-10290703-B2 · May 14, 2019 · US
Power device integration on a common substrate
US-2018069077-A1 · Mar 8, 2018 · US
Power device integration on a common substrate
US-9825124-B2 · Nov 21, 2017 · US
Power device on bulk substrate
US-2017229536-A1 · Aug 10, 2017 · US
Recent patents
Latest publications not already listed above.
Power device integration on a common substrate
US-2016343802-A1 · Nov 24, 2016 · US
Power device integration on a common substrate
US-9412881-B2 · Aug 9, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Silanna Asia Pte Ltd | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/9415 | 12 |
| H10W72/942 | 12 |
| H10W72/29 | 12 |
| H10W72/20 | 12 |
| H10W72/012 | 12 |