Sheet for packaging electronic part
US-12576622-B2 · Mar 17, 2026 · US
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YANAKA Ryosuke patents
YANAKA Ryosuke is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | YANAKA Ryosuke |
| Total patents | 12 |
| First publication | Jun 3, 2021 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Layered sheet, container, carrier tape, and electronic component packaging body
US-12154818-B2 · Nov 26, 2024 · US
Electronic article packaging sheet
US-2024317475-A1 · Sep 26, 2024 · US
Resin sheet for packaging electronic component, and electronic component packaging container using same
US-2024309158-A1 · Sep 19, 2024 · US
Sheet for packaging electronic part
US-2024059053-A1 · Feb 22, 2024 · US
Resin sheet, container, carrier tape, and electronic component packaging
US-2024010806-A1 · Jan 11, 2024 · US
Resin sheet, container, carrier tape, and electronic component packaging body
US-2023279190-A1 · Sep 7, 2023 · US
Layered sheet, electronic component packaging container, and electronic component packaging
US-11701874-B2 · Jul 18, 2023 · US
Layered sheet, container, carrier tape, and electronic component packaging body
US-2023084488-A1 · Mar 16, 2023 · US
Layered sheet, electronic component packaging container, and electronic component packaging
US-2022194067-A1 · Jun 23, 2022 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Denka Company Ltd | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B27/08 | 10 |
| B32B27/302 | 10 |
| B32B2250/24 | 9 |
| B32B2270/00 | 7 |
| B32B27/308 | 7 |