Resin sheet, container, carrier tape, and electronic component packaging body

Patent metadata

Field	Value
Publication number	US-2023279190-A1
Application number	US-202118005784-A
Country	US
Kind code	A1
Filing date	Jun 7, 2021
Priority date	Aug 5, 2020
Publication date	Sep 7, 2023
Grant date	—

Abstract

A resin sheet is for molding, has an impact strength of 1.0 J or greater in a DuPont impact test, and has a value of 80 N/m 2 or smaller obtained through integration from an origin point to a strain when fracture has occurred in a stress strain curve obtained in a tensile test. A carrier tape 100 is a molded body 16 of the resin sheet, wherein an accommodation portions 20 capable of accommodating an article is provided.

First claim

1 . A resin sheet for molding,
wherein the impact strength in a DuPont impact test is 1.0 J or greater, and wherein in a stress strain curve obtained in a tensile test, a value obtained through integration from an origin point to a strain when fracture has occurred is 80 N/m 2 or smaller.

2 . The resin sheet according to claim 1 ,
wherein at least one kind of a polycarbonate resin and an ABS resin is contained.

3 . The resin sheet according to claim 1 comprising:
a base material layer; and
a surface layer laminated on at least one surface of the base material layer,
wherein the base material layer includes at least one kind of a polycarbonate resin and an ABS resin, and an inorganic filler, and
wherein the surface layer includes at least one kind of a polycarbonate resin and an ABS resin, and a conductive material.

4 . The resin sheet according to claim 3 ,
wherein a content of the inorganic filler in the base material layer is 0.3 to 28 mass % based on a total amount of the base material layer.

5 . The resin sheet according to claim 3 ,
wherein an average primary particle size of the inorganic filler is 10 nm to 5.0 μm.

6 . The resin sheet according to claim 3 ,
wherein the base material layer includes carbon black as the inorganic filler.

7 . The resin sheet according to claim 3 ,
wherein a content of the conductive material in the surface layer is 10 to 30 mass % based on a total amount of the surface layer.

8 . The resin sheet according to claim 3 ,
wherein a thickness of the base material layer is 70% to 97% with respect to a thickness of the entire resin sheet.

9 . A container that is a molded body of the resin sheet according to claim 1 .

10 . A carrier tape that is a molded body of the resin sheet according to claim 1 ,
wherein an accommodation portion capable of accommodating an article is provided.

11 . An electronic component packaging body comprising:
the carrier tape according to claim 10 ; an electronic component accommodated in the accommodation portion of the carrier tape; and a cover film adhered to the carrier tape as a lid material.

Assignees

• Denka Company Ltd

Inventors

• YANAKA Ryosuke
• Saito Takeshi
• SAWAGUCHI Kota

Classifications

• Y02W30/80

  Packaging reuse or recycling, e.g. of multilayer packaging (bio-packaging Y02W90/10) · CPC title

• C08K3/04 Primary

  Carbon · CPC title

• C08L69/00

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title

• B65D73/02

  Articles, e.g. small electrical components, attached to webs · CPC title

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title