Layered sheet, container, carrier tape, and electronic component packaging body

Patent metadata

Field	Value
Publication number	US-12154818-B2
Application number	US-202117793538-A
Country	US
Kind code	B2
Filing date	Mar 8, 2021
Priority date	Mar 19, 2020
Publication date	Nov 26, 2024
Grant date	Nov 26, 2024

Abstract

A layered sheet 10 includes a substrate layer 1 , and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1 . The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.

First claim

The invention claimed is:

1. A layered sheet comprising:
a substrate layer; and a surface layer configured to be layered on at least one surface of the substrate layer,
wherein the substrate layer contains a first thermoplastic resin and inorganic fillers,
wherein the surface layer contains a second thermoplastic resin and a conductive material,
wherein the second thermoplastic resin includes a polycarbonate resin and a polyester resin, and
wherein a content of the inorganic fillers in the substrate layer is 0.3 to 28 mass % based on a total amount of the substrate layer.

2. The layered sheet according to claim 1 , wherein an average primary particle size of the inorganic fillers is 25 nm to 5.0 μm.

3. The layered sheet according to claim 1 , wherein the substrate layer contains carbon black as the inorganic fillers.

4. The layered sheet according to claim 1 , wherein the first thermoplastic resin includes a polycarbonate resin and a polyester resin, and the substrate layer contains, as the inorganic fillers, inorganic fillers formed of the same material as the conductive material contained in the surface layer.

5. The layered sheet according to claim 1 , wherein a content of the conductive material in the surface layer is 10 to 30 mass % based on a total amount of the surface layer.

6. The layered sheet according to claim 1 , wherein a thickness of the substrate layer is 70% to 97% of a thickness of the entire layered sheet.

7. A container configured to be a molded body of the layered sheet according to claim 1 .

8. A carrier tape configured to be a molded body of the layered sheet according to claim 1 and be provided with an accommodation portion capable of accommodating an article.

9. An electronic component packaging body comprising:
the carrier tape according to claim 8 ;
an electronic component configured to be accommodated in the accommodation portion of the carrier tape; and
a cover film configured to be adhered to the carrier tape as a lid material.

10. The layered sheet according to claim 1 , wherein the first thermoplastic resin includes a styrene-based resin.

11. A layered sheet comprising: a substrate layer; and a surface layer configured to be layered on at least one surface of the substrate layer, wherein the substrate layer contains a first thermoplastic resin and inorganic fillers, wherein the surface layer contains a second thermoplastic resin and a conductive material, and wherein the first thermoplastic resin includes a high-impact polystyrene resin, wherein the second thermoplastic resin includes a high-impact polystyrene resin.

12. The layered sheet according to claim 11 , wherein an average primary particle size of the inorganic fillers is 25 nm to 5.0 μm.

13. The layered sheet according to claim 11 , wherein the substrate layer contains carbon black as the inorganic fillers.

14. The layered sheet according to claim 11 , wherein the substrate layer contains, as the first thermoplastic resin, a thermoplastic resin of the same kind as the second thermoplastic resin contained in the surface layer and contains, as the inorganic fillers, inorganic fillers formed of the same material as the conductive material contained in the surface layer.

15. The layered sheet according to claim 11 , wherein a content of the conductive material in the surface layer is 10 to 30 mass % based on a total amount of the surface layer.

16. The layered sheet according to claim 11 , wherein a thickness of the substrate layer is 70% to 97% of a thickness of the entire layered sheet.

17. A container configured to be a molded body of the layered sheet according to claim 11 .

18. A carrier tape configured to be a molded body of the layered sheet according to claim 11 and be provided with an accommodation portion capable of accommodating an article.

19. An electronic component packaging body comprising: the carrier tape according to claim 18 ;
an electronic component configured to be accommodated in the accommodation portion of the carrier tape; and
a cover film configured to be adhered to the carrier tape as a lid material.

Assignees

• Denka Company Ltd

Inventors

• Fukuda Yuko
• Fujiwara Junpei
• YANAKA Ryosuke

Classifications

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• B32B2439/02

  Open containers · CPC title

• B32B2398/20

  Thermoplastics · CPC title

• B32B2313/04

  Carbon · CPC title

• B32B2305/30

  Fillers, e.g. particles, powders, beads, flakes, spheres, chips · CPC title