Roll material for manufacturing electromagnetic induction sealing liner and sealing liner
US-2024424770-A1 · Dec 26, 2024 · US
Sheet for packaging electronic part
US2024059053A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024059053-A1 |
| Application number | US-202118269817-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 14, 2021 |
| Priority date | Jan 8, 2021 |
| Publication date | Feb 22, 2024 |
| Grant date | — |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.
First claim
Opening claim text (preview).
1 . An electronic device packaging sheet comprising a substrate sheet having at least one substrate layer comprising: a thermoplastic resin (I); and a resin (II) which comprises at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. 2 . The electronic device packaging sheet according to claim 1 , wherein the substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %. 3 . The electronic device packaging sheet according to claim 1 , wherein the (meth)acrylic acid alkyl ester copolymer (A) comprises an acrylic acid alkyl ester monomer unit (a1) having an alkyl group with a carbon number of 4-8. 4 . The electronic device packaging sheet according to claim 1 , wherein the thermoplastic resin (I) comprises at least one thermoplastic resin selected from an ABS-based resin and a PC-based resin. 5 . The electronic device packaging sheet according to claim 1 , wherein the thermoplastic resin (I) comprises an ABS-based resin at 70-100 mass % with respect to the total mass of the thermoplastic resin (I). 6 . The electronic device packaging sheet according to claim 1 , wherein the substrate sheet has at least one dividing layer which divides the substrate layer. 7 . The electronic device packaging sheet according to claim 6 , wherein the average value of the thickness of an individual substrate layer is equal to or greater than the average value of the thickness of an individual dividing layer. 8 . A molded article comprising the electronic device packaging sheet according to claim 1 . 9 . The molded article according to claim 8 , wherein the molded article is a container. 10 . The molded article according to claim 8 , wherein the molded article is a carrier tape. 11 . The electronic device packaging sheet according to claim 2 , wherein the (meth)acrylic acid alkyl ester copolymer (A) comprises an acrylic acid alkyl ester monomer unit (a1) having an alkyl group with a carbon number of 4-8. 12 . The electronic device packaging sheet according to claim 2 , wherein the thermoplastic resin (I) comprises at least one thermoplastic resin selected from an ABS-based resin and a PC-based resin. 13 . The electronic device packaging sheet according to claim 3 , wherein the thermoplastic resin (I) comprises at least one thermoplastic resin selected from an ABS-based resin and a PC-based resin. 14 . The electronic device packaging sheet according to claim 2 , wherein the thermoplastic resin (I) comprises an ABS-based resin at 70-100 mass % with respect to the total mass of the thermoplastic resin (I). 15 . The electronic device packaging sheet according to claim 3 , wherein the thermoplastic resin (I) comprises an ABS-based resin at 70-100 mass % with respect to the total mass of the thermoplastic resin (I). 16 . The electronic device packaging sheet according to claim 4 , wherein the thermoplastic resin (I) comprises an ABS-based resin at 70-100 mass % with respect to the total mass of the thermoplastic resin (I). 17 . The electronic device packaging sheet according to claim 2 , wherein the substrate sheet has at least one dividing layer which divides the substrate layer. 18 . The electronic device packaging sheet according to claim 3 , wherein the substrate sheet has at least one dividing layer which divides the substrate layer. 19 . The electronic device packaging sheet according to claim 4 , wherein the substrate sheet has at least one dividing layer which divides the substrate layer. 20 . The electronic device packaging sheet according to claim 5 , wherein the substrate sheet has at least one dividing layer which divides the substrate layer.
Assignees
Inventors
Classifications
Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title
- B32B27/08Primary
of synthetic resin · CPC title
comprising acrylic (co)polymers · CPC title
comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers · CPC title
Packaging equipment or accessories not otherwise provided for · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2024059053A1 cover?
- An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least o…
- Who is the assignee on this patent?
- Denka Company Ltd
- What technology area does this patent fall under?
- Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Feb 22 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).