Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate
US-12482739-B2 · Nov 25, 2025 · US
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Werner Ronny patents
Werner Ronny is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Werner Ronny |
| Total patents | 6 |
| First publication | Jul 11, 2019 |
| Latest publication | Nov 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate
US-2025112142-A1 · Apr 3, 2025 · US
Semiconductor module comprising at least one semiconductor element
US-2024038630-A1 · Feb 1, 2024 · US
Semiconductor module with a supporting structure on the bottom side
US-10699984-B2 · Jun 30, 2020 · US
Semiconductor module with a supporting structure on the bottom side
US-2019393122-A1 · Dec 26, 2019 · US
Power module
US-2019214340-A1 · Jul 11, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siemens Ag | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 4 |
| H10W90/401 | 3 |
| H10W90/701 | 2 |
| H10W70/658 | 2 |
| H10W40/00 | 2 |