Method of manufacturing a semiconductor device and a semiconductor device
US-2025364267-A1 · Nov 27, 2025 · US
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Wei Yu-Chen patents
Wei Yu-Chen is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Yu-Chen |
| Total patents | 32 |
| First publication | Jan 1, 2019 |
| Latest publication | Nov 27, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of manufacturing a semiconductor device and a semiconductor device
US-12451363-B2 · Oct 21, 2025 · US
Vacuum assembly for chemical mechanical polishing
US-12409529-B2 · Sep 9, 2025 · US
Vacuum assembly for chemical mechanical polishing
US-2024383100-A1 · Nov 21, 2024 · US
Chemical mechanical polishing apparatus and method
US-12076831-B2 · Sep 3, 2024 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-2024203750-A1 · Jun 20, 2024 · US
Method for forming semiconductor device structure
US-12009222-B2 · Jun 11, 2024 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-11984324-B2 · May 14, 2024 · US
Chemical mechanical polishing apparatus with integrated slurry mixer-dispenser and methods for operating the same
US-2023373062-A1 · Nov 23, 2023 · US
Method and system for performing chemical mechanical polishing
US-2023278160-A1 · Sep 7, 2023 · US
Recent patents
Latest publications not already listed above.
Chemical mechanical polishing apparatus and method
US-2023264317-A1 · Aug 24, 2023 · US
Method and system for performing chemical mechanical polishing
US-11685015-B2 · Jun 27, 2023 · US
Chemical mechanical polishing method
US-11673223-B2 · Jun 13, 2023 · US
Chemical mechanical polishing method
US-2022219285-A1 · Jul 14, 2022 · US
Method for forming semiconductor device structure
US-2022115243-A1 · Apr 14, 2022 · US
Chemical mechanical polishing apparatus and method
US-11292101-B2 · Apr 5, 2022 · US
Article transporter in semiconductor fabrication
US-11251063-B2 · Feb 15, 2022 · US
Method for forming semiconductor device structure
US-11239092-B2 · Feb 1, 2022 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-2021407819-A1 · Dec 30, 2021 · US
Vacuum Assembly for Chemical Mechanical Polishing
US-2021060728-A1 · Mar 4, 2021 · US
Article transporter in semiconductor fabrication
US-2021028049-A1 · Jan 28, 2021 · US
Vacuum assembly for chemical mechanical polishing
US-10843307-B2 · Nov 24, 2020 · US
Article transferring method in semiconductor fabrication
US-10804133-B2 · Oct 13, 2020 · US
Method for forming semiconductor device structure
US-2020258758-A1 · Aug 13, 2020 · US
Method and system for performing chemical mechanical polishing
US-2020238473-A1 · Jul 30, 2020 · US
Method for forming semiconductor device structure
US-10636673-B2 · Apr 28, 2020 · US
Vacuum assembly for chemical mechanical polishing
US-2020101580-A1 · Apr 2, 2020 · US
Chemical mechanical polishing apparatus and method
US-2019152016-A1 · May 23, 2019 · US
Article transferring method in semiconductor fabrication
US-2019157129-A1 · May 23, 2019 · US
Method for forming semiconductor device structure
US-2019096693-A1 · Mar 28, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 33 |
| Taiwan Semiconductor Mfg Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/403 | 27 |
| H01L21/3212 | 25 |
| B24B37/20 | 15 |
| H10D84/038 | 14 |
| H10D84/0158 | 14 |