Three dimensional IC package with thermal enhancement
US-12519029-B2 · Jan 6, 2026 · US
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Wei Xiaojin patents
Wei Xiaojin is listed as an inventor on 46 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Xiaojin |
| Total patents | 46 |
| First publication | Sep 17, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-chip module package technology for advanced driver assistance system application
US-2025265220-A1 · Aug 21, 2025 · US
Modular Liquid Cooling Architecture For Liquid Cooling
US-2025076940-A1 · Mar 6, 2025 · US
Modular liquid cooling architecture for liquid cooling
US-12174676-B2 · Dec 24, 2024 · US
Three Dimensional IC Package with Thermal Enhancement
US-2024186214-A1 · Jun 6, 2024 · US
Three dimensional IC package with thermal enhancement
US-11967538-B2 · Apr 23, 2024 · US
Temperature control element utilized in device die packages
US-11955406-B2 · Apr 9, 2024 · US
Temperature Control Element Utilized in Device Die Packages
US-2023163048-A1 · May 25, 2023 · US
Modular Liquid Cooling Architecture For Liquid Cooling
US-2023161391-A1 · May 25, 2023 · US
Three Dimensional IC Package with Thermal Enhancement
US-2022328376-A1 · Oct 13, 2022 · US
Recent patents
Latest publications not already listed above.
Containment heatsink for packaged battery cells
US-11081738-B2 · Aug 3, 2021 · US
Battery pack capacity optimization via self-regulation of cell temperature
US-10903534-B2 · Jan 26, 2021 · US
Cooled containment compartments for packaged battery cells
US-10797359-B2 · Oct 6, 2020 · US
Heat pipe and vapor chamber heat dissipation
US-2020084917-A1 · Mar 12, 2020 · US
Heat pipe and vapor chamber heat dissipation
US-10575440-B2 · Feb 25, 2020 · US
Battery pack capacity optimization via self-regulation of cell temperature
US-2019372179-A1 · Dec 5, 2019 · US
Cooled containment compartments for packaged battery cells
US-2019296402-A1 · Sep 26, 2019 · US
Blast tubing for packaging battery cells
US-2019280354-A1 · Sep 12, 2019 · US
Containment heatsink for packaged battery cells
US-2019280352-A1 · Sep 12, 2019 · US
Cooled containment compartments for packaged battery cells
US-10374263-B2 · Aug 6, 2019 · US
Cooled containment compartments for packaged battery cells
US-10374264-B2 · Aug 6, 2019 · US
Manufacturing electronic package with heat transfer element(s)
US-10237964-B2 · Mar 19, 2019 · US
Cooled containment compartments for packaged battery cells
US-2019067750-A1 · Feb 28, 2019 · US
Cooled containment compartments for packaged battery cells
US-2019067749-A1 · Feb 28, 2019 · US
Heat pipe and vapor chamber heat dissipation
US-2018288902-A1 · Oct 4, 2018 · US
Heat pipe and vapor chamber heat dissipation
US-10045464-B1 · Aug 7, 2018 · US
Heat pipe and vapor chamber heat dissipation
US-9980410-B1 · May 22, 2018 · US
Flexible coolant manifold—heat sink assembly
US-9913403-B2 · Mar 6, 2018 · US
Changeable, airflow venting cover assembly for an electronics rack
US-9894807-B2 · Feb 13, 2018 · US
Thermal management in a multi-phase power system
US-9639105-B2 · May 2, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 36 |
| Google Llc | 9 |
| Int Business Machines Corporations | 1 |
| Rivian Ip Holdings Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/226 | 11 |
| H01M10/613 | 11 |
| Y02E60/10 | 11 |
| H10W40/47 | 11 |
| H10W40/037 | 9 |