Heat pipe and vapor chamber heat dissipation

Patent metadata

Field	Value
Publication number	US-10575440-B2
Application number	US-201815987972-A
Country	US
Kind code	B2
Filing date	May 24, 2018
Priority date	Mar 31, 2017
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

First claim

What is claimed:

1. A method of dissipating heat from an electronic component, the method comprising:
positioning one or more heat pipes onto a baseplate,
wherein the one or more heat pipes is in thermal communication with the baseplate,
wherein the one or more heat pipes has one or more internal cavities;

attaching one or more vapor chambers to the one or more heat pipes,
wherein the one or more vapor chambers has one or more internal cavities,
wherein the one or more internal cavities of the one or more heat pipes is contiguous to the one or more internal cavities of the one or more vapor,
wherein the one or more vapor chambers extends from the one or more heat pipes;

attaching one or more heat conducting fins to the one or more vapor chambers;
wherein the one or more heat conducting fins extends from the one or more vapor chambers;

putting fluid in the contiguous cavity formed by the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more vapor chambers;
installing the baseplate onto an electronic component;
applying pressure to the electronic component through the baseplate;
evaporating the fluid at an inner surface of the one or more heat pipes;
condensing the fluid at an inner surface of the one or more vapor chambers;
forming the baseplate with cut-outs to accommodate the one or more heat pipes,
wherein one or more solid material islands is formed between the one or more cut-outs,
wherein the one or more islands is configured to take pressure applied to it; and installing a load plate above the baseplate, above the one or more islands, and below the one or more fins,

wherein the one or more islands is configured to take pressure applied to it via the load plate.

2. The method of claim 1 further comprising positioning the one or more heat pipes according to a power density of one or more electrical components.

3. The method of claim 1 further comprising soldering the one or more vapor chambers to the one or more heat pipes.

Assignees

• IBM

Inventors

• Wei Xiaojin
• Vandeventer Allan C

Classifications

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20309

  Evaporators · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title