Heat pipe and vapor chamber heat dissipation

Patent metadata

Field	Value
Publication number	US-2018288902-A1
Application number	US-201815987972-A
Country	US
Kind code	A1
Filing date	May 24, 2018
Priority date	Mar 31, 2017
Publication date	Oct 4, 2018
Grant date	—

Abstract

The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

First claim

What is claimed:

1 . A heat dissipation device comprising:
a baseplate; one or more heat pipes in thermal communication with the baseplate,
wherein the one or more heat pipes has one or more internal cavities;
one or more vapor chambers coupled to the one or more heat pipes,
wherein the one or more vapor chambers has one or more internal cavities,
wherein the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous,
wherein the one or more vapor chambers extends from the one or more heat pipes; and
one or more heat conducting fins coupled to the one or more vapor chambers,
wherein the one or more heat conducting fins extends from the one or more vapor chambers.

2 . The heat dissipation device of claim 1 , wherein the one or more heat pipes is able to be positioned according to a power density of one or more electronic components.

3 . The heat dissipation device of claim 1 ,
wherein the baseplate has one or more cut-outs, wherein the one or more heat pipes is embedded in the one or more cut-outs, wherein walls of the one or more cut-outs form one or more islands.

4 . The heat dissipation device of claim 3 , further comprising:
a load plate above the baseplate, above the one or more islands, and below the one or more fins,
wherein the one or more islands is configured to provide a mechanical load transfer path from the load plate to the baseplate.

5 . The heat dissipation device of claim 1 , wherein the one or more vapor chambers is soldered to the one or more heat pipes.

6 . The heat dissipation device of claim 1 , wherein the one or more fins is soldered, along a bent side edge of the one or more fins, to one or more flat portions of the one or more vapor chambers.

7 . The heat dissipation device of claim 1 , wherein at least one of the one or more heat pipes, and at least one of the one or more vapor chambers are hermetically interconnected and cooperatively form at least one sealed chamber.

8 . The heat dissipation device of claim 1 , wherein the one or more vapor chambers has a substantially rectangular cross section.

9 . A method of fabricating a heat dissipating device, the method comprising:
positioning one or more heat pipes onto a baseplate,
wherein the one or more heat pipes is in thermal communication with the baseplate,
wherein the one or more heat pipes has one or more internal cavities;
attaching one or more vapor chambers to the one or more heat pipes,
wherein the one or more vapor chambers has one or more internal cavities,
wherein the one or more internal cavities of the one or more heat pipes is contiguous to the one or more internal cavities of the one or more vapor chambers,
wherein the one or more vapor chambers extends from the one or more heat pipes;
putting fluid in the contiguous cavity formed by the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more vapor chambers; and attaching one or more heat conducting fins to the one or more vapor chambers,
wherein the one or more heat conducting fins extends from the one or more vapor chambers.

10 . The method of claim 9 further comprising positioning the one or more heat pipes according to a power density of one or more electrical components.

11 . The method of claim 9 , further comprising:
forming the baseplate with cut-outs to accommodate the one or more heat pipes; installing the one or more heat pipes in the one or more cut-outs; wherein the walls of the one or more cut-outs form one or more islands.

12 . The method of claim 11 , further comprising:
installing a load plate above the baseplate, above the one or more islands, and below the one or more fins,
wherein the one or more islands is configured to take pressure applied to it via the load plate.

13 . The method of claim 9 further comprising soldering the one or more vapor chambers to the one or more heat pipes.

14 . The method of claim 9 further comprising soldering the one or more fins, along a bent side edge of the one or more fins, to one or more flat portions of the one or more vapor chambers.

15 . The method of claim 9 further comprising hermetically attaching at least one of the one or more heat pipes to at least one of the one or more vapor chambers, thereby cooperatively forming at least one sealed chamber.

16 . The method of claim 9 further comprising using a thermally conductive paste to facilitate the thermal communication.

17 . A method of dissipating heat from an electronic component, the method comprising:
positioning one or more heat pipes onto a baseplate,
wherein the one or more heat pipes is in thermal communication with the baseplate,
wherein the one or more heat pipes has one or more internal cavities;
attaching one or more vapor chambers to the one or more heat pipes,
wherein the one or more vapor chambers has one or more internal cavities,
wherein the one or more internal cavities of the one or more heat pipes is contiguous to the one or more internal cavities of the one or more vapor,
wherein the one or more vapor chambers extends from the one or more heat pipes;
attaching one or more heat conducting fins to the one or more vapor chambers;
wherein the one or more heat conducting fins extends from the one or more vapor chambers;
putting fluid in the contiguous cavity formed by the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more vapor chambers; installing the baseplate onto an electronic component; applying pressure to the electronic component through the baseplate; evaporating the fluid at an inner surface of the one or more heat pipes; and condensing the fluid at an inner surface of the one or more vapor chambers.

18 . The method of claim 17 further comprising positioning the one or more heat pipes according to a power density of one or more electrical components.

19 . The method of claim 17 , further comprising:
forming the baseplate with cut-outs to accommodate the one or more heat pipes, wherein one or more solid material islands is formed between the one or more cut-outs, wherein the one or more islands is configured to take pressure applied to it; and installing a load plate above the baseplate, above the one or more islands, and below the one or more fins,
wherein the one or more islands is configured to take pressure applied to it via the load plate.

20 . The method of claim 17 further comprising soldering the one or more vapor chambers to the one or more heat pipes.

Assignees

• IBM

Inventors

• Wei Xiaojin
• Vandeventer Allan C

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20309

  Evaporators · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title