Three-dimensional memory devices having through stair contacts and methods for forming the same
US-12035530-B2 · Jul 9, 2024 · US
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Wei Qinxiang patents
Wei Qinxiang is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Qinxiang |
| Total patents | 15 |
| First publication | Nov 7, 2019 |
| Latest publication | Jul 9, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2024023333-A1 · Jan 18, 2024 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2023301105-A1 · Sep 21, 2023 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-11716846-B2 · Aug 1, 2023 · US
Structures and methods for reducing stress in three-dimensional memory device
US-11450770-B2 · Sep 20, 2022 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2021082953-A1 · Mar 18, 2021 · US
Through array contact (TAC) for three-dimensional memory devices
US-10937806-B2 · Mar 2, 2021 · US
Structures and methods for reducing stress in three-dimensional memory device
US-2021050446-A1 · Feb 18, 2021 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-10847539-B2 · Nov 24, 2020 · US
Structures and methods for reducing stress in three-dimensional memory device
US-10825929-B2 · Nov 3, 2020 · US
Recent patents
Latest publications not already listed above.
Through array contact (tac) for three-dimensional memory devices
US-2020266211-A1 · Aug 20, 2020 · US
Structures and methods for reducing stress in three-dimensional memory device
US-2020227555-A1 · Jul 16, 2020 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2020212058-A1 · Jul 2, 2020 · US
Through array contact (TAC) for three-dimensional memory devices
US-10658378-B2 · May 19, 2020 · US
Through array contact (tac) for three-dimensional memory devices
US-2019341399-A1 · Nov 7, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 15 |
| H10W20/081 | 11 |
| H10W20/056 | 11 |
| H10W20/42 | 11 |
| H10W20/076 | 11 |