Self-aligned scheme for semiconductor device and method of forming the same
US-2025364328-A1 · Nov 27, 2025 · US
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Wang Wei-Ren patents
Wang Wei-Ren is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Wei-Ren |
| Total patents | 27 |
| First publication | Dec 19, 2019 |
| Latest publication | Nov 27, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Self-aligned scheme for semiconductor device and method of forming the same
US-12476146-B2 · Nov 18, 2025 · US
Interconnect structures and methods of forming the same
US-2025343073-A1 · Nov 6, 2025 · US
Interconnect Structure and Method of Forming the Same
US-2025336721-A1 · Oct 30, 2025 · US
Interconnect structure and method of forming the same
US-12438041-B2 · Oct 7, 2025 · US
Interconnect structures and methods of forming the same
US-12347726-B2 · Jul 1, 2025 · US
Semiconductor structure and manufacturing method thereof
US-2025149438-A1 · May 8, 2025 · US
Semiconductor device and method
US-12237224-B2 · Feb 25, 2025 · US
Semiconductor structure and manufacturing method thereof
US-12230567-B2 · Feb 18, 2025 · US
Interconnect Structures and Methods of Forming the Same
US-2024387253-A1 · Nov 21, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method
US-2024387268-A1 · Nov 21, 2024 · US
Patterning methods for semiconductor devices
US-12074058-B2 · Aug 27, 2024 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-11901228-B2 · Feb 13, 2024 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-2023377966-A1 · Nov 23, 2023 · US
Interconnect Structure and Method of Forming the Same
US-2023335436-A1 · Oct 19, 2023 · US
Patterning methods for semiconductor devices
US-2023260829-A1 · Aug 17, 2023 · US
Patterning methods for semiconductor devices
US-11676852-B2 · Jun 13, 2023 · US
Patterned Semiconductor Device and Method
US-2023154753-A1 · May 18, 2023 · US
Interconnect Structures and Methods of Forming the Same
US-2023135172-A1 · May 4, 2023 · US
Semiconductor Device and Method
US-2023121210-A1 · Apr 20, 2023 · US
Semiconductor structure and manufacturing method thereof
US-2023068625-A1 · Mar 2, 2023 · US
Self-Aligned Scheme for Semiconductor Device and Method of Forming the Same
US-2022319922-A1 · Oct 6, 2022 · US
Patterning Methods for Semiconductor Devices
US-2021134656-A1 · May 6, 2021 · US
Morphology of resist mask prior to etching
US-10978301-B2 · Apr 13, 2021 · US
Patterning methods for semiconductor devices
US-10867839-B2 · Dec 15, 2020 · US
Morphology of Resist Mask Prior to Etching
US-2020075319-A1 · Mar 5, 2020 · US
Patterning Methods for Semiconductor Devices
US-2019385902-A1 · Dec 19, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 29 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/0149 | 20 |
| H10D84/038 | 20 |
| H10W20/42 | 18 |
| H10W20/069 | 18 |
| H10W20/075 | 18 |