Semiconductor package having reduced parasitic inductance
US-12575467-B2 · Mar 10, 2026 · US
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Wang Long-Ching patents
Wang Long-Ching is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Long-Ching |
| Total patents | 64 |
| First publication | Aug 13, 2015 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same
US-12568845-B2 · Mar 3, 2026 · US
Semiconductor package having side protections and method of making the same
US-2026005202-A1 · Jan 1, 2026 · US
Semiconductor package having two or more driver devices and method of making the same
US-2025357279-A1 · Nov 20, 2025 · US
Semiconductor package having ultra-thin substrate and method of making the same
US-2025323108-A1 · Oct 16, 2025 · US
Semiconductor package having partially plated lead flank and method of making the same
US-2025266333-A1 · Aug 21, 2025 · US
Semiconductor package having wettable lead flanks and tie bars and method of making the same
US-2025183132-A1 · Jun 5, 2025 · US
Power module having interconnected base plate with molded metal and method of making the same
US-2025183123-A1 · Jun 5, 2025 · US
Chip scale package (csp) semiconductor device having thin substrate
US-2025174524-A1 · May 29, 2025 · US
Battery protection package having co-packed transistors and integrated circuit and method of making the same
US-2025157894-A1 · May 15, 2025 · US
Recent patents
Latest publications not already listed above.
Apparatus having surface mount packages having co-packed field effect transistors
US-2025118638-A1 · Apr 10, 2025 · US
Semiconductor package having lead frame with slanted sections
US-2025112132-A1 · Apr 3, 2025 · US
Semiconductor package having wettable lead flanks and tie bars and method of making the same
US-12261101-B2 · Mar 25, 2025 · US
Semiconductor package having interposer and method of making the same
US-2025096081-A1 · Mar 20, 2025 · US
Chip scale package (CSP) semiconductor device having thin substrate
US-12243808-B2 · Mar 4, 2025 · US
Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same
US-2025069973-A1 · Feb 27, 2025 · US
Semiconductor rigid chip-scale package and method of making the same
US-2025070049-A1 · Feb 27, 2025 · US
Semiconductor package having high metal bumps and ultra-thin substrate and method of making the same
US-2025070069-A1 · Feb 27, 2025 · US
Semiconductor package having multiple redistribution layers and method of making the same
US-2024429140-A1 · Dec 26, 2024 · US
Semiconductor package having mold locking feature
US-12142548-B2 · Nov 12, 2024 · US
Semiconductor package having reduced parasitic inductance
US-2024096768-A1 · Mar 21, 2024 · US
Semiconductor package having wettable lead flanks and tie bars and method of making the same
US-2023420340-A1 · Dec 28, 2023 · US
Semiconductor package having thin substrate and method of making the same
US-11784141-B2 · Oct 10, 2023 · US
Chip scale package (csp) semiconductor device having thin substrate
US-2023307325-A1 · Sep 28, 2023 · US
Wafer level chip scale semiconductor package
US-11721665-B2 · Aug 8, 2023 · US
DMOS FET chip scale package and method of making the same
US-11699627-B2 · Jul 11, 2023 · US
Semiconductor package having mold locking feature
US-2023215783-A1 · Jul 6, 2023 · US
Semiconductor package having wettable lead flank and method of making the same
US-11581195-B2 · Feb 14, 2023 · US
Semiconductor package having thin substrate and method of making the same
US-2023021687-A1 · Jan 26, 2023 · US
Semiconductor package having thin substrate and method of making the same
US-11495548-B2 · Nov 8, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Alpha & Omega Semiconductor Int Lp | 30 |
| Alpha & Omega Semiconductor Cayman Ltd | 13 |
| Marvell World Trade Ltd | 10 |
| Alpha & Omega Semiconductor Int Lp | 9 |
| Alpha & Omega Semiconductor Cayman Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 31 |
| H10W70/481 | 26 |
| H10W90/00 | 25 |
| H10W74/00 | 23 |
| H10W72/0198 | 22 |