Processing chip, design method, and electronic device
US-2026081606-A1 · Mar 19, 2026 · US
Wang Kanwen is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Kanwen |
| Total patents | 18 |
| First publication | Sep 5, 2019 |
| Latest publication | Mar 19, 2026 |
Publications ranked by popularity score, then publication date.
US-2026081606-A1 · Mar 19, 2026 · US
US-12547883-B2 · Feb 10, 2026 · US
US-2026029849-A1 · Jan 29, 2026 · US
US-12499940-B2 · Dec 16, 2025 · US
US-2025150619-A1 · May 8, 2025 · US
US-12100448-B2 · Sep 24, 2024 · US
US-2024013037-A1 · Jan 11, 2024 · US
US-11705180-B2 · Jul 18, 2023 · US
US-2022374694-A1 · Nov 24, 2022 · US
US-2022277199-A1 · Sep 1, 2022 · US
Latest publications not already listed above.
US-2022262435-A1 · Aug 18, 2022 · US
US-2022076746-A1 · Mar 10, 2022 · US
US-11232031-B2 · Jan 25, 2022 · US
US-2021335417-A1 · Oct 28, 2021 · US
US-11074958-B2 · Jul 27, 2021 · US
US-2020066331-A1 · Feb 27, 2020 · US
US-2020066330-A1 · Feb 27, 2020 · US
US-2019272230-A1 · Sep 5, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 18 |
| Univ Tsinghua | 6 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06N3/065 | 7 |
| G11C11/54 | 6 |
| G11C11/40618 | 5 |
| G11C11/406 | 5 |
| G11C11/40611 | 5 |