Audio signal processing method and audio processing device
US-2026080887-A1 · Mar 19, 2026 · US
This page is not indexed by search engines while we improve data quality.
Wang Chia-Wei patents
Wang Chia-Wei is listed as an inventor on 67 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Chia-Wei |
| Total patents | 67 |
| First publication | May 5, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic system and security authority delegation method thereof
US-12536273-B2 · Jan 27, 2026 · US
Reticle enclosure for lithography systems
US-2026016761-A1 · Jan 15, 2026 · US
Shared pump structure that can dynamically adjust its phase ratio and control method thereof
US-12525878-B2 · Jan 13, 2026 · US
Event reporting method, security management circuit, and management system
US-12511381-B2 · Dec 30, 2025 · US
Shared pump structure that can dynamically adjust its phase ratio and control method thereof
US-2025379517-A1 · Dec 11, 2025 · US
Photolithography apparatus and method of operating the same
US-2025362622-A1 · Nov 27, 2025 · US
Photolithography apparatus and method of operating the same
US-2025362623-A1 · Nov 27, 2025 · US
Package structure
US-2025364340-A1 · Nov 27, 2025 · US
Lithography system and method including thermal management
US-2025355373-A1 · Nov 20, 2025 · US
Recent patents
Latest publications not already listed above.
Package structure including a die having a taper-shaped die connector
US-12469757-B2 · Nov 11, 2025 · US
Method for detecting damages of touch display panel
US-12429980-B1 · Sep 30, 2025 · US
Lithography system and method including thermal management
US-2025172885-A1 · May 29, 2025 · US
Semiconductor packages and method of forming the same
US-2025087627-A1 · Mar 13, 2025 · US
Package structure
US-2025029946-A1 · Jan 23, 2025 · US
System and method for reducing extreme ultraviolet (euv) vessel tin deposition
US-2025021005-A1 · Jan 16, 2025 · US
Semiconductor packages and method of forming the same
US-12176321-B2 · Dec 24, 2024 · US
Redistribution structure and method of forming the same
US-2024387450-A1 · Nov 21, 2024 · US
Package structure and method of fabrcating the same
US-12148732-B2 · Nov 19, 2024 · US
Integrated circuit, package structure, and manufacturing method of package structure
US-12132023-B2 · Oct 29, 2024 · US
Method for resetting processor and computer device
US-2024345640-A1 · Oct 17, 2024 · US
Event reporting method, security management circuit, and management system
US-2024320328-A1 · Sep 26, 2024 · US
Package structure
US-2024282653-A1 · Aug 22, 2024 · US
Electronic system and security authority delegation method thereof
US-2024232334-A9 · Jul 11, 2024 · US
Package structure having at least one die with a plurality of taper-shaped die connectors
US-11990383-B2 · May 21, 2024 · US
Electronic system and security authority delegation method thereof
US-2024134968-A1 · Apr 25, 2024 · US
Lithography system and method including thermal management
US-2024004316-A1 · Jan 4, 2024 · US
Package structure and method of forming thereof
US-2023054148-A1 · Feb 23, 2023 · US
Integrated circuit, package structure, and manufacturing method of package structure
US-2023048907-A1 · Feb 16, 2023 · US
Integrated circuit, package structure, and manufacturing method of package structure
US-11515276-B2 · Nov 29, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 34 |
| Mediatek Inc | 23 |
| Aspeed Technology Inc | 6 |
| Novatek Microelectronics Corp | 3 |
| Univ Nat Chiao Tung | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/611 | 24 |
| H10W90/00 | 22 |
| H10W70/09 | 21 |
| H10W70/60 | 21 |
| H10W70/685 | 21 |