Flip-chip bonding structure and substrate thereof
US-12543581-B2 · Feb 3, 2026 · US
Wang Chen-Yu is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Chen-Yu |
| Total patents | 26 |
| First publication | Apr 9, 2015 |
| Latest publication | Feb 3, 2026 |
Publications ranked by popularity score, then publication date.
US-12543581-B2 · Feb 3, 2026 · US
US-12538805-B2 · Jan 27, 2026 · US
US-12525481-B2 · Jan 13, 2026 · US
US-2026012180-A1 · Jan 8, 2026 · US
US-12317462-B2 · May 27, 2025 · US
US-2025125716-A1 · Apr 17, 2025 · US
US-12224183-B2 · Feb 11, 2025 · US
US-2024194646-A1 · Jun 13, 2024 · US
US-2024105664-A1 · Mar 28, 2024 · US
US-2024074127-A1 · Feb 29, 2024 · US
Latest publications not already listed above.
US-2023420287-A1 · Dec 28, 2023 · US
US-2023378044-A1 · Nov 23, 2023 · US
US-2023187378-A1 · Jun 15, 2023 · US
US-2023135424-A1 · May 4, 2023 · US
US-11476772-B2 · Oct 18, 2022 · US
US-2021126548-A1 · Apr 29, 2021 · US
US-10826067-B2 · Nov 3, 2020 · US
US-10791601-B2 · Sep 29, 2020 · US
US-2019289685-A1 · Sep 19, 2019 · US
US-2018351179-A1 · Dec 6, 2018 · US
US-2018158078-A1 · Jun 7, 2018 · US
US-2017046952-A1 · Feb 16, 2017 · US
US-9373275-B2 · Jun 21, 2016 · US
US-2015363157-A1 · Dec 17, 2015 · US
US-2015134090-A1 · May 14, 2015 · US
US-2015097612-A1 · Apr 9, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Chipbond Technology Corp | 12 |
| Epistar Corp | 4 |
| Airoha Tech Corp | 2 |
| Raydium Semiconductor Corp | 2 |
| Univ Nat Cheng Kung | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/65 | 10 |
| H10W90/701 | 10 |
| H10W90/00 | 6 |
| H10W72/20 | 6 |
| H10W90/724 | 6 |