Substrate processing apparatus and substrate processing method
US-10923329-B2 · Feb 16, 2021 · US
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Urayama Daisuke patents
Urayama Daisuke is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Urayama Daisuke |
| Total patents | 7 |
| First publication | Feb 19, 2015 |
| Latest publication | Feb 16, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for etching copper layer
US-10825688-B2 · Nov 3, 2020 · US
Substrate processing apparatus and substrate processing method
US-2020111646-A1 · Apr 9, 2020 · US
Method for etching copper layer
US-2019272997-A1 · Sep 5, 2019 · US
Plasma processing method and plasma processing apparatus
US-9660182-B2 · May 23, 2017 · US
Substrate processing apparatus and substrate processing method
US-2015132970-A1 · May 14, 2015 · US
Plasma processing method and plasma processing apparatus
US-2015050750-A1 · Feb 19, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/242 | 7 |
| H01J37/32834 | 5 |
| H01L43/12 | 5 |
| H10N50/01 | 5 |
| H10P72/0421 | 3 |