Method for manufacturing aluminum-doped thin film using 4-coordinate aluminum precursor
US-2026049397-A1 · Feb 19, 2026 · US
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Uchiuzou Hiroyuki patents
Uchiuzou Hiroyuki is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Uchiuzou Hiroyuki |
| Total patents | 20 |
| First publication | Sep 24, 2015 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Organometallic compound and method of manufacturing integrated circuit using the same
US-12473309-B2 · Nov 18, 2025 · US
Method for selective deposition of layer of interest
US-2025305120-A1 · Oct 2, 2025 · US
Organometallic adduct compound and method of manufacturing integrated circuit using the same
US-12410203-B2 · Sep 9, 2025 · US
Method of manufacturing semiconductor device
US-2023369039-A1 · Nov 16, 2023 · US
Molybdenum compound and method of manufacturing integrated circuit device using the same
US-11746121-B2 · Sep 5, 2023 · US
Methods of manufacturing integrated circuit devices using carbonyl compounds
US-2023215723-A1 · Jul 6, 2023 · US
Organometallic adduct compound and method of manufacturing integrated circuit device by using the same
US-2022324887-A1 · Oct 13, 2022 · US
Organometallic compound and method of manufacturing integrated circuit using the same
US-2021388010-A1 · Dec 16, 2021 · US
Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the same
US-2021380622-A1 · Dec 9, 2021 · US
Recent patents
Latest publications not already listed above.
Molybdenum compound and method of manufacturing integrated circuit device using the same
US-2021300955-A1 · Sep 30, 2021 · US
Organometallic adduct compound and method of manufacturing integrated circuit using the same
US-2021284667-A1 · Sep 16, 2021 · US
Method of forming a thin film
US-10752645-B2 · Aug 25, 2020 · US
Method of forming a thin film
US-2019292207-A1 · Sep 26, 2019 · US
Method for producing a thin film
US-10364495-B2 · Jul 30, 2019 · US
Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit device
US-10329312-B2 · Jun 25, 2019 · US
Method for producing a thin film
US-2017211184-A1 · Jul 27, 2017 · US
Aluminum compound, thin-film forming raw material, and method for producing thin film
US-9663538-B2 · May 30, 2017 · US
Cobalt compound, thin film-forming raw material, and method for producing thin film
US-2017050998-A1 · Feb 23, 2017 · US
Aluminum compound, thin-firm forming raw material, and method for producing thin film
US-2015266904-A1 · Sep 24, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Adeka Corp | 19 |
| Samsung Electronics Co Ltd | 15 |
| Adeka Korea Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C16/45553 | 17 |
| C23C16/405 | 10 |
| C23C16/34 | 8 |
| H10P14/43 | 7 |
| C07F17/00 | 6 |