Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs

Patent metadata

Field	Value
Publication number	US-9929028-B2
Application number	US-201615296547-A
Country	US
Kind code	B2
Filing date	Oct 18, 2016
Priority date	Oct 20, 2015
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

First claim

What is claimed is:

1. A cluster tool system for processing wafers, comprising:
a wafer transport assembly extending along a longitudinal axis of the cluster tool system;
at least two process modules coupled to the wafer transport assembly along a lateral side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the at least two process modules coupled along the lateral side;
a service tunnel defined underneath the wafer transport assembly, the service tunnel extending along the longitudinal axis of the cluster tool system, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor that is positioned underneath the wafer transport assembly.

2. The cluster tool system of claim 1 , wherein the service floor is defined at a height that is less than a height of a fabrication facility floor in which the cluster tool system is disposed.

3. The cluster tool system of claim 2 , wherein the height of the service floor is approximately 1 feet (30.5 cm) to 2 feet (61 cm) below the height of the fabrication facility floor.

4. The cluster tool system of claim 1 , wherein the wafer transport assembly includes at least two wafer transport modules that are coupled to each other along the longitudinal axis, wherein each of the wafer transport modules couples to one of the process modules that is coupled along the lateral side of the wafer transport assembly.

5. The cluster tool system of claim 4 , further comprising:
at least two process module frames configured to support the at least two process modules coupled along the lateral side of the wafer transport assembly, and further configured to rest on the fabrication facility floor.

6. The cluster tool system of claim 1 , wherein the wafer transport assembly has a front end oriented towards an equipment front end module (EFEM), the wafer transport assembly having a rear end opposite the front end.

7. The cluster tool system of claim 6 , wherein the service tunnel extends along the longitudinal axis from the front end to the rear end of the wafer transport assembly.

8. The cluster tool system of claim 6 , wherein the front end of the wafer transport assembly is configured for connection to a load lock that controls access to and from the EFEM, wherein a front end of the service tunnel extends substantially to the EFEM.

9. The cluster tool system of claim 6 , wherein a stair set is defined at a rear end of the service tunnel that is defined substantially underneath the rear end of the wafer transport assembly, the stair set configured to define a path from the fabrication floor down to the service floor.

10. The cluster tool system of claim 1 , wherein a height of the service tunnel is approximately 6 feet (183 cm) to 8 feet (244 cm).

11. The cluster tool system of claim 1 , wherein a lateral side of the service tunnel provides access to the process modules coupled along the lateral side of the wafer transport assembly.

12. The cluster tool system of claim 11 , wherein the lateral side of the service tunnel provides access to one or more gas boxes defined for the process modules coupled along the lateral side of the wafer transport assembly.

13. The cluster tool system of claim 1 , wherein the service tunnel is compliant with SEMI E72 standards.

14. A cluster tool system for processing wafers, comprising:
a wafer transport assembly extending along a longitudinal axis of the cluster tool system;
one or more process modules coupled to the wafer transport assembly along a first lateral side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the one or more process modules coupled along the first lateral side;
one or more process modules coupled to the wafer transport assembly along a second lateral side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the one or more process modules coupled along the second lateral side;
a service tunnel defined underneath the wafer transport assembly, the service tunnel extending along the longitudinal axis of the cluster tool system, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor that is positioned underneath the wafer transport assembly.

15. The cluster tool system of claim 14 , wherein the wafer transport assembly has a front end configured for connection to a load lock, the wafer transport assembly having a rear end opposite the front end, the service tunnel extending along the longitudinal axis of the cluster tool system from the front end to the rear end of the wafer transport assembly.

16. The cluster tool system of claim 14 , wherein the service floor is defined at a height that is less than a height of a fabrication facility floor in which the cluster tool system is disposed, wherein the height of the service floor is approximately 1 feet (30 cm) to 2 feet (60 cm) below the height of the fabrication facility floor.

17. The cluster tool system of claim 16 , further comprising:
one or more process module frames configured to support the one or more process modules coupled along the first lateral side of the wafer transport assembly, and further configured to rest on the fabrication facility floor;
one or more process module frames configured to support the one or more process modules coupled along the second lateral side of the wafer transport assembly, and further configured to rest on the fabrication facility floor;
wherein a height of the service tunnel is defined by the height of the service floor and a height of the process module frames, the height of the service tunnel being approximately 6 feet (180 cm) to 8 feet (240 cm).

18. A cluster tool system for processing wafers, comprising:
a wafer transport assembly extending along a longitudinal axis of the cluster tool system;
one or more process modules coupled to the wafer transport assembly along a first side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the one or more process modules coupled along the first side;
one or more process modules coupled to the wafer transport assembly along a second side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the one or more process modules coupled along the second side;
a service tunnel defined underneath the wafer transport assembly, the service tunnel extending along the longitudinal axis of the cluster tool system, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor that is positioned underneath the wafer transport assembly.

19. The cluster tool system of claim 18 , wherein the wafer transport assembly has a front end configured for connection to a load lock, the wafer transport assembly having a rear end opposite the front end, the service tunnel extending along the longitudinal axis of the cluster tool system from the front end to the rear end of the wafer transport assembly.

20. The cluster tool system of claim 18 , wherein the service floor is defined at a height that is less than a height of a fabrication facility floor in which the cluster tool system is disposed, wherein the height of the service floor is approximately 1 feet (30 cm) to 2 feet (60 cm) below the height of the fabrication facility floor.

Assignees

• Lam Res Corp

Inventors

• Trussell David
• Daugherty John
• Kellogg Michael
• Pena Christopher
• Gould Richard
• Kunkel Klay

Classifications

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title

• H10P72/3221

  Overhead conveying · CPC title

• H10P72/3216

  using a general scheme of a conveying path within a factory · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title