Wafer transport assembly with integrated buffers

Patent metadata

Field	Value
Publication number	US-10790174-B2
Application number	US-201815951333-A
Country	US
Kind code	B2
Filing date	Apr 12, 2018
Priority date	Oct 20, 2015
Publication date	Sep 29, 2020
Grant date	Sep 29, 2020

Abstract

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

First claim

What is claimed is:

1. A wafer transport assembly, comprising:
a first wafer transport module;
a second wafer transport module; and
a buffer module, arranged between the first wafer transport module and the second wafer transport module, including a first buffer stack and a second buffer stack,
wherein outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively,
wherein the first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly, and
wherein the wafer transport assembly is defined over a service tunnel that extends from a front end of the wafer transport assembly to a rear end of the wafer transport assembly.

2. A wafer transport assembly, comprising:
a first wafer transport module;
a second wafer transport module;
a buffer module, arranged between the first wafer transport module and the second wafer transport module, including a first buffer stack and a second buffer stack,
wherein outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively, and
wherein the first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly;
first, second, third and fourth gas boxes arranged in the continuous wafer transport volume and configured to deliver gas mixtures to the first, second, third and fourth process modules, respectively; and
an exhaust duct to selectively evacuate the first, second, third and fourth process modules,
wherein the first, second, third and fourth gas boxes include perforations along surfaces thereof such that gases are evacuated from the first, second, third and fourth gas boxes into the exhaust duct.

3. The wafer transport assembly of claim 2 , further comprising:
a plurality of gas lines supplying gases to the first, second, third and fourth gas boxes, wherein the plurality of gas lines run through the exhaust duct to the first, second, third and fourth gas boxes.

4. The wafer transport assembly of claim 3 , wherein the plurality of gas lines supplying the first, second, third and fourth gas boxes run in the exhaust duct from a region outside of the continuous wafer transport volume to a region inside of the continuous wafer transport volume.

5. A wafer transport assembly, comprising:
a first wafer transport module;
a second wafer transport module;
a buffer module, arranged between the first wafer transport module and the second wafer transport module, including a first buffer stack and a second buffer stack,
wherein outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively, and
wherein the first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly; and
a service tunnel defined underneath the wafer transport assembly,
wherein the service tunnel has a vertical dimension defined between an underside of the wafer transport assembly and a service floor that is positioned underneath the wafer transport assembly.

6. The wafer transport assembly of claim 5 , wherein the service floor is defined at a height that is less than a height of a fabrication facility floor.

7. The wafer transport assembly of claim 6 , wherein the height of the service floor is between 30.5 cm to 61 cm below the height of the fabrication facility floor.

8. The wafer transport assembly of claim 7 , wherein a height of the service tunnel is in a range from 183 cm to 244 cm.

9. A wafer transport assembly, comprising:
a first wafer transport module;
a second wafer transport module; and
a buffer module, arranged between the first wafer transport module and the second wafer transport module, including a first buffer stack and a second buffer stack,
wherein outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively,
wherein the first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly,
wherein a first portion of the first buffer stack defines a first plurality of wafer storage slots and includes one or more separators defined between each of the first plurality of wafer storage slots, and
wherein a second portion of the first buffer stack defines a second plurality of wafer storage slots that does not include separators defined between each of the second plurality of wafer storage slots.

10. The wafer transport assembly of claim 9 , wherein at least one of the first wafer transport module and the second wafer transport module stores at least one of a seasoning wafer and a cover wafer in the second portion of the first buffer stack and at least one of a processed wafer and an unprocessed wafer in the first portion of the first buffer stack.

Assignees

• Lam Res Corp

Inventors

• Daugherty John
• Trussell David
• Kellogg Michael
• Pena Christopher
• Gould Richard H
• Kunkel Klay

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0452

  characterised by the layout of the process chambers · CPC title

• H10P72/0464 Primary

  characterised by the construction of the transfer chamber · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/3404

  Storage means · CPC title