Package for a lateral power transistor
US-2024162136-A1 · May 16, 2024 · US
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Tee Guan Choon Matthew Nelson patents
Tee Guan Choon Matthew Nelson is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tee Guan Choon Matthew Nelson |
| Total patents | 7 |
| First publication | Sep 7, 2017 |
| Latest publication | May 16, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Manufacturing a package using plateable encapsulant
US-11081417-B2 · Aug 3, 2021 · US
Semiconductor device with bond pad extensions formed on molded appendage
US-11081455-B2 · Aug 3, 2021 · US
Semiconductor Device with Bond Pad Extensions Formed on Molded Appendage
US-2020343205-A1 · Oct 29, 2020 · US
Manufacturing a package using plateable encapsulant
US-2019341324-A1 · Nov 7, 2019 · US
Semiconductor package with plateable encapsulant and a method for manufacturing the same
US-10396007-B2 · Aug 27, 2019 · US
Manufacturing a package using plateable encapsulant
US-2017256472-A1 · Sep 7, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
| Infineon Technologies Austria Ag | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 6 |
| H10W74/019 | 6 |
| H10W74/01 | 6 |
| H10W74/111 | 6 |
| H01L21/56 | 6 |