Electromagnetic waveguiding through liquid cooling conduit
US-12451448-B2 · Oct 21, 2025 · US
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Tang Junyan patents
Tang Junyan is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tang Junyan |
| Total patents | 19 |
| First publication | Apr 19, 2018 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Dense via pitch interconnect to increase wiring density
US-12266598-B2 · Apr 1, 2025 · US
Processor package substrate with high-speed top-surface connection to cable interconnect
US-2024321802-A1 · Sep 26, 2024 · US
Dense via pitch interconnect to increase wiring density
US-2024234284-A9 · Jul 11, 2024 · US
Dense via pitch interconnect to increase wiring density
US-2024136270-A1 · Apr 25, 2024 · US
Electromagnetic waveguiding through liquid cooling conduit
US-2023420394-A1 · Dec 28, 2023 · US
Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)
US-11658378-B2 · May 23, 2023 · US
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication
US-11399428-B2 · Jul 26, 2022 · US
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (SIWs) WITHIN A MULTILAYERED PRINTED CIRCUIT BOARD (PCB)
US-2021111472-A1 · Apr 15, 2021 · US
Pcb with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication
US-2021112655-A1 · Apr 15, 2021 · US
Recent patents
Latest publications not already listed above.
Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures
US-10879575-B2 · Dec 29, 2020 · US
Embedded Filtering in PCB Integrated Ultra High Speed Dielectric Waveguides Using Photonic Band Gap Structures
US-2020112075-A1 · Apr 9, 2020 · US
Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
US-10199706-B2 · Feb 5, 2019 · US
Reduction of crosstalk between dielectric waveguides using split ring resonators
US-10181628-B2 · Jan 15, 2019 · US
Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
US-10141623-B2 · Nov 27, 2018 · US
Reduction of crosstalk between dielectric waveguides using split ring resonators
US-2018115043-A1 · Apr 26, 2018 · US
Dielectric-based waveguiding in a multi-layer pcb
US-2018115042-A1 · Apr 26, 2018 · US
Neural Network Based Prediction of PCB Glass Weave Induced Skew
US-2018113974-A1 · Apr 26, 2018 · US
Dielectric waveguide and coupling mechanism in a printed circuit board
US-2018108971-A1 · Apr 19, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 19 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0243 | 12 |
| H05K1/0298 | 11 |
| H01P3/121 | 10 |
| H01P3/16 | 10 |
| H01P11/006 | 6 |