Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-12331402-B2 · Jun 17, 2025 · US
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Tan Taide patents
Tan Taide is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tan Taide |
| Total patents | 16 |
| First publication | Oct 6, 2016 |
| Latest publication | Jun 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-2024318312-A1 · Sep 26, 2024 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-12000047-B2 · Jun 4, 2024 · US
Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
US-2023323535-A1 · Oct 12, 2023 · US
Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
US-11674226-B2 · Jun 13, 2023 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-2023175134-A1 · Jun 8, 2023 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-11608559-B2 · Mar 21, 2023 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-2021371982-A1 · Dec 2, 2021 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-11101164-B2 · Aug 24, 2021 · US
Temperature controlled spacer for use in a substrate processing chamber
US-11004662-B2 · May 11, 2021 · US
Recent patents
Latest publications not already listed above.
Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
US-2020190667-A1 · Jun 18, 2020 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-10604841-B2 · Mar 31, 2020 · US
Temperature Controlled Spacer For Use In A Substrate Processing Chamber
US-2018233326-A1 · Aug 16, 2018 · US
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US-2018163305-A1 · Jun 14, 2018 · US
Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
US-2017002465-A1 · Jan 5, 2017 · US
Plasma processing systems and structures having sloped confinement rings
US-2016289827-A1 · Oct 6, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 16 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C16/45565 | 15 |
| H01J37/32715 | 14 |
| H01J37/32642 | 14 |
| H01J37/32082 | 13 |
| H10P72/7606 | 13 |