CMP safe alignment mark
US-12255150-B2 · Mar 18, 2025 · US
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Su Jheng-Si patents
Su Jheng-Si is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Su Jheng-Si |
| Total patents | 15 |
| First publication | Oct 4, 2018 |
| Latest publication | Mar 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Cmp safe alignment mark
US-2024387398-A1 · Nov 21, 2024 · US
Chemical mechanical polishing apparatus and method
US-12076831-B2 · Sep 3, 2024 · US
Chemical mechanical polishing apparatus and method
US-2023264317-A1 · Aug 24, 2023 · US
Chemical mechanical polishing method
US-11673223-B2 · Jun 13, 2023 · US
Chemical mechanical polishing method
US-2022219285-A1 · Jul 14, 2022 · US
Chemical mechanical polishing apparatus and method
US-11292101-B2 · Apr 5, 2022 · US
Cmp safe alignment mark
US-2022102285-A1 · Mar 31, 2022 · US
Article transporter in semiconductor fabrication
US-11251063-B2 · Feb 15, 2022 · US
Polishing process for forming semiconductor device structure
US-11094554-B2 · Aug 17, 2021 · US
Recent patents
Latest publications not already listed above.
Article transporter in semiconductor fabrication
US-2021028049-A1 · Jan 28, 2021 · US
Article transferring method in semiconductor fabrication
US-10804133-B2 · Oct 13, 2020 · US
Chemical mechanical polishing apparatus and method
US-2019152016-A1 · May 23, 2019 · US
Article transferring method in semiconductor fabrication
US-2019157129-A1 · May 23, 2019 · US
Polishing process for forming semiconductor device structure
US-2018286699-A1 · Oct 4, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/20 | 10 |
| H10P52/403 | 8 |
| B24B53/017 | 8 |
| H01L21/3212 | 8 |
| B24B49/16 | 6 |