Semiconductor chip package and method of assembly
US-11948878-B2 · Apr 2, 2024 · US
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Steinhoff Stefan patents
Steinhoff Stefan is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Steinhoff Stefan |
| Total patents | 8 |
| First publication | Apr 16, 2015 |
| Latest publication | Apr 2, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor chip package and method of assembly
US-2023032658-A1 · Feb 2, 2023 · US
Semiconductor chip package and method of assembly
US-11488903-B2 · Nov 1, 2022 · US
Semiconductor chip contact structure, device assembly, and method of fabrication
US-11094614-B2 · Aug 17, 2021 · US
Semiconductor chip package and method of assembly
US-2021233838-A1 · Jul 29, 2021 · US
Semiconductor chip contact structure, device assembly, and method of fabrication
US-2021090972-A1 · Mar 25, 2021 · US
Sintered backside shim in a press pack cassette
US-9099316-B2 · Aug 4, 2015 · US
Sintered backside shim in a press pack cassette
US-2015102481-A1 · Apr 16, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Littelfuse Inc | 6 |
| Ixys Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/073 | 6 |
| H10W90/00 | 4 |
| H10W70/69 | 4 |
| H10W70/023 | 4 |
| H10W70/658 | 4 |