Hybrid metallization surfaces for integrated circuit packages
US-2025006616-A1 · Jan 2, 2025 · US
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Steill Jason patents
Steill Jason is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Steill Jason |
| Total patents | 10 |
| First publication | Mar 31, 2022 |
| Latest publication | Jan 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Selectively roughened copper architectures for low insertion loss conductive features
US-12033930-B2 · Jul 9, 2024 · US
Package substrate embedded multi-layered in via capacitors
US-2024222035-A1 · Jul 4, 2024 · US
Method of forming a package substrate
US-2024188222-A1 · Jun 6, 2024 · US
Pocketed copper in first layer interconnect and method
US-2024006291-A1 · Jan 4, 2024 · US
Sinx based surface finish architecture
US-2024006299-A1 · Jan 4, 2024 · US
Asymmetrical dielectric-to-metal adhesion architecture for electronic packages
US-2023420353-A1 · Dec 28, 2023 · US
Single lithography methods for interconnect architectures
US-2023420346-A1 · Dec 28, 2023 · US
Multi-pathway routing via through hole
US-2023420298-A1 · Dec 28, 2023 · US
Selectively roughened copper architectures for low insertion loss conductive features
US-2022102259-A1 · Mar 31, 2022 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 7 |
| H10W70/05 | 6 |
| H10W70/65 | 6 |
| H01L23/49838 | 6 |
| H10W90/701 | 5 |