Semiconductor test structure and method for forming the same
US-10699973-B2 · Jun 30, 2020 · US
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Spinney Patrick S patents
Spinney Patrick S is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Spinney Patrick S |
| Total patents | 11 |
| First publication | Jan 24, 2017 |
| Latest publication | Jun 30, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor test structure and method for forming the same
US-2019139841-A1 · May 9, 2019 · US
Semiconductor chip with anti-reverse engineering function
US-10141274-B2 · Nov 27, 2018 · US
Test structure for monitoring interface delamination
US-10056306-B2 · Aug 21, 2018 · US
Semiconductor chip with anti-reverse engineering function
US-2018053734-A1 · Feb 22, 2018 · US
Semiconductor chip with anti-reverse engineering function
US-9893023-B2 · Feb 13, 2018 · US
Semiconductor chip with anti-reverse engineering function
US-2017263574-A1 · Sep 14, 2017 · US
Test strucutre for monitoring interface delamination
US-2017229358-A1 · Aug 10, 2017 · US
Semiconductor chip with anti-reverse engineering function
US-9711464-B2 · Jul 18, 2017 · US
Semiconductor chip with anti-reverse engineering function
US-2017084552-A1 · Mar 23, 2017 · US
Recent patents
Latest publications not already listed above.
Wiring bond pad structures
US-9553061-B1 · Jan 24, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 6 |
| Globalfoundries Inc | 4 |
| Globalfounders Inc | 1 |
| Globalfoundries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/012 | 6 |
| H10W20/0698 | 6 |
| H10W20/42 | 6 |
| H10W42/40 | 6 |
| H01L23/5226 | 6 |