Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
US-11244910-B2 · Feb 8, 2022 · US
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Sorrieul Marika patents
Sorrieul Marika is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sorrieul Marika |
| Total patents | 12 |
| First publication | May 26, 2016 |
| Latest publication | Feb 8, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for fabricating an electronic device and a stacked electronic device
US-2020258850-A1 · Aug 13, 2020 · US
Method for fabricating an electronic device and a stacked electronic device
US-10672721-B2 · Jun 2, 2020 · US
Electronic package with a local slot forming an air-vent
US-10651101-B2 · May 12, 2020 · US
Method for fabricating an electronic device and a stacked electronic device
US-2019103368-A1 · Apr 4, 2019 · US
Method for fabricating an electronic device and a stacked electronic device
US-10177098-B2 · Jan 8, 2019 · US
Electronic package with a local slot forming an air-vent
US-2018337104-A1 · Nov 22, 2018 · US
Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive
US-9773740-B2 · Sep 26, 2017 · US
Method for fabricating an electronic device and a stacked electronic device
US-2017133520-A1 · May 11, 2017 · US
Process of fabrication of electronic devices and electronic device with a double encapsulation ring
US-9472692-B2 · Oct 18, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Grenoble 2 | 8 |
| Stmicroelectronics (Grenoble 2) Sas | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10F77/50 | 12 |
| H01L31/0203 | 10 |
| H10W90/754 | 10 |
| H10W74/114 | 10 |
| H10W72/0198 | 10 |