Electronic package with a local slot forming an air-vent

Patent metadata

Field	Value
Publication number	US-2018337104-A1
Application number	US-201815978439-A
Country	US
Kind code	A1
Filing date	May 14, 2018
Priority date	May 16, 2017
Publication date	Nov 22, 2018
Grant date	—

Abstract

A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.

First claim

1 . A package, comprising:
a support plate having a front face; at least one electronic chip mounted on the front face of the support plate; a cover which encapsulates the at least one electronic chip, said cover comprising a front wall extending in front of the at least one electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the encapsulating cover define at least one chamber in which the at least one electronic chip is located; and at least one local slot arranged between the peripheral wall of the encapsulating cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said at least one local slot connecting said chamber and the exterior.

2 . The package according to claim 1 , comprising a fixing glue bead inserted between the end edge of the peripheral wall of the encapsulating cover and said peripheral area of the support plate, wherein the fixing glue bead has a local break including said at least one local slot.

3 . The package according to claim 1 , wherein said at least one local slot includes a local groove arranged in the front face of the support plate.

4 . The package according to claim 1 , wherein said at least one local slot includes a local groove arranged in the end edge of the peripheral wall of the encapsulating cover.

5 . The package according to claim 1 , further comprising at least one interior divider located between the at least one electronic chip and the interior opening of said at least one local slot.

6 . The package according to claim 5 , wherein said at least one interior divider projects from the front face of the support plate.

7 . The package according to claim 5 , wherein said at least one interior divider has ends attached at two spaced-apart sites of the peripheral wall of the encapsulating cover, these two spaced-apart sites being located on either side of said at least one local slot.

8 . The package according to claim 5 , wherein a front edge of said at least one interior divider is located in front of the front edge of said at least one local slot.

9 . The package according to claim 5 , wherein said at least one interior divider comprises a glue bead extending over the front face of the support plate and extending from a squashed glue bead which fixes the end edge on the peripheral area of the support plate.

10 . The package according to claim 1 , wherein said at least one electronic chip is provided, in the front face thereof, with at least one optical sensor, the front wall of the encapsulating cover having at least one through-hole and being provided with an optical element filling said at least one through-hole and transmitting light.

11 . The package according to claim 1 , wherein said at least one electronic chip is provided, in the front face thereof, with two optical sensors, said encapsulating cover being provided with a separating internal partition defining two cavities in said chamber, inside which said two optical sensors are located; and
further comprising an electronic chip provided with a light radiation emitter placed in one of said two cavities; and wherein said front wall of the encapsulating cover has through-holes located on either side of the internal partition and is provided with optical elements filling the through-holes, respectively, and transmitting light.

12 . A package, comprising:
a support plate having a front face; a local slot having an internal end and an external end; an electronic chip mounted on the front face of the support plate; a bead of glue that peripherally surrounds the electronic chip, said bead of glue including a squashed portion and an un-squashed portion; a cover which encapsulates the electronic chip, said cover comprising a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed to the front face of the support plate via the squashed portion of the bead of glue, said peripheral wall passing over said local slot at a position between the internal end and the external end of the local slot; and wherein the un-squashed portion of the bead of glue is positioned between an edge of the electronic chip and the internal end of the local slot.

13 . The package of claim 12 , wherein said local slot defines an air vent between an interior of the cover and an exterior.

14 . The package of claim 12 , wherein the local slot is located in the front face of the support plate.

15 . The package of claim 12 , wherein the local slot is located in the end edge of the peripheral wall.

16 . A package, comprising:
a support plate having a front face; at least one electronic chip mounted on the front face of the support plate; a cover which encapsulates the electronic chip, said cover comprising a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the encapsulating cover define at least one chamber in which the electronic chip is located; and a local slot arranged between the peripheral wall of the encapsulating cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said at least one local slot connecting said chamber and the exterior, wherein said local slot includes a local groove arranged in the end edge of the peripheral wall of the encapsulating cover; and an interior divider located between the chip and the interior opening of said local slot.

17 . The package according to claim 16 , comprising a fixing glue bead inserted between the end edge of the peripheral wall of the encapsulating cover and said peripheral area of the support plate, wherein the fixing glue bead has a local break including said local slot.

18 . The package according to claim 16 , wherein said local slot includes a local groove arranged in the front face of the support plate.

19 . The package according to claim 16 , wherein said interior divider projects from the front face of the support plate.

20 . The package according to claim 16 , wherein said interior divider has ends attached at two spaced-apart sites of the peripheral wall of the encapsulating cover, these two spaced-apart sites being located on either side of said local slot.

21 . The package according to claim 16 , wherein a front edge of said interior divider is located in front of the front edge of said local slot.

22 . The package according to claim 16 , wherein said interior divider comprises a glue bead extending over the front face of the support plate and extending from a squashed glue bead which fixes the end edge on the peripheral area of the support plate.

23 . The package according to claim 16 , wherein said chip is provided, in the front face thereof, with at least one optical sensor, the front wall of the encapsulating cover having at least one through-hole and being provided with an optical element filling said at least one through-hole and transmitting light.

24 . The package according to claim 16 , wherein said chip is provided, in the front face thereof, with two optical sensors, said encapsulating cover being provided with a separating internal partition defining two cavities in said chamber, inside which said two optical sensors are located; and
further comprising a chip provided with a light radiation emitter placed in one

Assignees

• St Microelectronics Grenoble 2

Inventors

• Sorrieul Marika

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W76/153 Primary

  having interconnections in passages through the insulating or insulated base · CPC title