Formation of metal vias on metal lines
US-12113020-B2 · Oct 8, 2024 · US
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Smith Ryan Scott patents
Smith Ryan Scott is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Smith Ryan Scott |
| Total patents | 10 |
| First publication | Feb 23, 2017 |
| Latest publication | Oct 8, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Silicon super junction structures for increased voltage
US-2024282809-A1 · Aug 22, 2024 · US
Nanofluidic device with silicon nitride membrane
US-11819847-B2 · Nov 21, 2023 · US
Formation of metal vias on metal lines
US-2022270979-A1 · Aug 25, 2022 · US
Manufacturing methods for dual pore sensors
US-2022242725-A1 · Aug 4, 2022 · US
Dual pore sensors
US-2022236250-A1 · Jul 28, 2022 · US
Nanofluidic device with silicon nitride membrane
US-2022016628-A1 · Jan 20, 2022 · US
Wafer level electrical test for optical proximity correction and/or etch bias
US-10078107-B2 · Sep 18, 2018 · US
Wafer level electrical test for optical proximity correction and/or etch bias
US-2017115337-A1 · Apr 27, 2017 · US
Method, apparatus, and system for passive die strain measurement
US-2017052014-A1 · Feb 23, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 7 |
| Globalfoundries Inc | 3 |
| Globalfounries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01N33/48721 | 4 |
| H10P74/277 | 3 |
| H10P74/207 | 3 |
| C12Q1/6869 | 2 |
| B01L3/502753 | 2 |