Post-gap fill treatment for seam reduction
US-2026040842-A1 · Feb 5, 2026 · US
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Singhal Akhil patents
Singhal Akhil is listed as an inventor on 55 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Singhal Akhil |
| Total patents | 55 |
| First publication | Jul 23, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Core removal
US-12532675-B2 · Jan 20, 2026 · US
Methods of depositing silicon-containing films for semiconductor devices
US-2026011547-A1 · Jan 8, 2026 · US
Reduced underlayer oxidation during gap fill
US-2026011548-A1 · Jan 8, 2026 · US
Methods for gap filling vertical and lateral features with plasma inhibition
US-2025372385-A1 · Dec 4, 2025 · US
Nested-loop atomic layer deposition with inhibition and/or etch
US-2025369113-A1 · Dec 4, 2025 · US
Bottom-up gap fill using non-conformal poisoning
US-2025357109-A1 · Nov 20, 2025 · US
Volumetric expansion deposition of silicon based dielectric film
US-2025329529-A1 · Oct 23, 2025 · US
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
US-12381106-B2 · Aug 5, 2025 · US
In situ protective coating of chamber components for semiconductor processing
US-12371781-B2 · Jul 29, 2025 · US
Recent patents
Latest publications not already listed above.
Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generation
US-12372872-B2 · Jul 29, 2025 · US
Helium-free silicon formation
US-12315724-B2 · May 27, 2025 · US
Reactive-ion deposition processes for dielectric material formation
US-2025046602-A1 · Feb 6, 2025 · US
Profile shaping for control gate recesses
US-12211908-B2 · Jan 28, 2025 · US
Doped silicon-containing materials with increased electrical, mechanical, and etch characteristics
US-2024332000-A1 · Oct 3, 2024 · US
Backside deposition for wafer bow management
US-2024096605-A1 · Mar 21, 2024 · US
Method to clean SnO2 film from chamber
US-11915923-B2 · Feb 27, 2024 · US
Deposition tool and method for depositing metal oxide films on organic materials
US-11887846-B2 · Jan 30, 2024 · US
Profile shaping for control gate recesses
US-2023411462-A1 · Dec 21, 2023 · US
Profile shaping for control gate recesses
US-11784229-B2 · Oct 10, 2023 · US
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
US-2023274968-A1 · Aug 31, 2023 · US
Advanced self aligned multiple patterning using tin oxide
US-2023238238-A1 · Jul 27, 2023 · US
Metal-containing passivation for high aspect ratio etch
US-11670516-B2 · Jun 6, 2023 · US
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
US-11646216-B2 · May 9, 2023 · US
Core removal
US-2023066676-A1 · Mar 2, 2023 · US
Protective coating for a semiconductor reaction chamber
US-2023038880-A1 · Feb 9, 2023 · US
Helium-free silicon formation
US-2022336216-A1 · Oct 20, 2022 · US
Extreme ultraviolet (euv) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generation
US-2022197147-A1 · Jun 23, 2022 · US
Profile shaping for control gate recesses
US-2022123114-A1 · Apr 21, 2022 · US
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
US-2022122872-A1 · Apr 21, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 35 |
| Applied Materials Inc | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6336 | 24 |
| H10P14/6339 | 23 |
| C23C16/50 | 18 |
| C23C16/56 | 18 |
| H10P14/69215 | 18 |