Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-11735689-B2 · Aug 22, 2023 · US
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Sengul Ali patents
Sengul Ali is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sengul Ali |
| Total patents | 11 |
| First publication | Dec 17, 2020 |
| Latest publication | Aug 22, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
US-11575069-B2 · Feb 7, 2023 · US
Curing pre-applied and plasma-etched underfill via a laser
US-11563142-B2 · Jan 24, 2023 · US
Curing pre-applied and laser-ablated underfill via a laser
US-2022393060-A1 · Dec 8, 2022 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-2022352412-A1 · Nov 3, 2022 · US
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
US-11404600-B2 · Aug 2, 2022 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-11374148-B2 · Jun 28, 2022 · US
Curing pre-applied and laser-ablated underfill via a laser
US-2020395503-A1 · Dec 17, 2020 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-2020395520-A1 · Dec 17, 2020 · US
Curing pre-applied and plasma-etched underfill via a laser
US-2020395519-A1 · Dec 17, 2020 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Facebook Tech Llc | 11 |
| Meta Platforms Tech Llc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W99/00 | 11 |
| H10W72/07168 | 11 |
| H10W72/07141 | 11 |
| H10W74/15 | 11 |
| H10W72/90 | 11 |