Method for depositing a copper seed layer onto a barrier layer and copper plating bath
US-2019024239-A1 · Jan 24, 2019 · US
This page is not indexed by search engines while we improve data quality.
Schreier Hans-Jürgen patents
Schreier Hans-Jürgen is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schreier Hans-Jürgen |
| Total patents | 6 |
| First publication | Jul 7, 2016 |
| Latest publication | Jan 24, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for depositing a copper seed layer onto a barrier layer and copper plating bath
US-10077498-B2 · Sep 18, 2018 · US
Adhesion promoting agents for metallization of substrate surfaces
US-9920432-B2 · Mar 20, 2018 · US
Iron boron alloy coatings and a process for their preparation
US-9783891-B2 · Oct 10, 2017 · US
Iron boron alloy coatings and a process for their preparation
US-2017121824-A1 · May 4, 2017 · US
Method for depositing a copper seed layer onto a barrier layer and copper plating bath
US-2016194760-A1 · Jul 7, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C18/1633 | 5 |
| C23C18/1683 | 5 |
| C23C18/1653 | 4 |
| C25D7/12 | 4 |
| H10P14/46 | 3 |