Iron boron alloy coatings and a process for their preparation

Patent metadata

Field	Value
Publication number	US-9783891-B2
Application number	US-201515127036-A
Country	US
Kind code	B2
Filing date	Mar 17, 2015
Priority date	Apr 24, 2014
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.

First claim

The invention claimed is:

1. An aqueous plating bath for the electroless deposition of iron boron alloy coatings, comprising
(i) at least one iron ion source;
(ii) at least one boron based reducing agent;
(iii) at least one complexing agent;
(iv) at least one pH buffer; and
(v) at least one base,
wherein the pH value of the aqueous plating bath is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1 and wherein it does not contain any intentionally added further reducible metal ions or it comprises a second source of reducible metal ions in an amount of 0.01 to 10 mol-% based on the amount of iron ions present in the aqueous plating bath.

2. The aqueous plating bath according to claim 1 , wherein the at least one iron ion source is a water soluble ferrous salt.

3. The aqueous plating bath according to claim 1 , wherein the concentration of the iron ions therein ranges from 25 mmol/l to 120 mmol/l.

4. The aqueous plating bath according to claim 1 , wherein the molar ratio of the boron based reducing agents to the iron ions lies in the range of 6:1 to 10:1.

5. The aqueous plating bath according to claim 1 , wherein the pH value ranges from 11 to 13.

6. The aqueous plating bath according to claim 1 , wherein the source of reducible metal ions is selected from nickel ions and cobalt ions.

7. A process for the electroless deposition of iron boron alloy coatings on substrates, wherein the process comprises the steps
(a) providing a substrate, and
(b) contacting said substrate with an aqueous plating bath according to claim 1 ; and thereby depositing an iron boron alloy coating onto said substrate.

8. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 7 , wherein the substrate is not electrically connected to any sacrificial anode.

9. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 7 , wherein the process further comprises a step to remove oxygen from the aqueous plating bath, its surrounding atmosphere, or from both the aqueous plating bath and its surrounding atmosphere.

10. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 9 , wherein the aqueous plating bath, its surrounding atmosphere, or from both the aqueous plating bath and its surrounding atmosphere is purged with an inert gas to remove oxygen therefrom.

11. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 7 , wherein the substrate is selected form the group consisting of metallic substrates, glass substrates, silicium substrates and plastic substrates.

12. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 11 , wherein copper substrates or copper alloy substrates are used.

13. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 11 , wherein the glass substrates, silicium substrates or plastic substrates are activated by a noble metal between steps (a) and (b).

14. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 7 , wherein for binary iron boron alloys are deposited.

15. The process for the electroless deposition of iron boron alloy coatings on substrates according to claim 14 , wherein the binary iron boron alloy coatings consist of 10 to 90 at.-% iron with the balance (to 100 at.-%) being boron.

Assignees

• Atotech Deutschland Gmbh

Inventors

• Blickensderfer Jacob
• Akolkar Rohan
• Altemare Paige
• Thiel Kay-Oliver
• Schreier Hans-Jürgen

Classifications

• C23C18/50 Primary

  with alloys based on iron, cobalt or nickel · CPC title

• C23C18/1633

  Process of electroless plating · CPC title

• C23C18/1675

  Process conditions · CPC title

• C23C18/1682

  Control of atmosphere · CPC title

• C23C18/52 Primary

  using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50 · CPC title