Method of manufacturing a semiconductor package, die, and die package
US-12489017-B2 · Dec 2, 2025 · US
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Sax Harry Walter patents
Sax Harry Walter is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sax Harry Walter |
| Total patents | 8 |
| First publication | Dec 2, 2021 |
| Latest publication | Dec 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip package and method of forming a chip package
US-2024371796-A1 · Nov 7, 2024 · US
Chip package and method of forming a chip package
US-12040288-B2 · Jul 16, 2024 · US
Chip package and method of forming a chip package
US-2023395532-A1 · Dec 7, 2023 · US
Chip package and method of forming a chip package
US-11735534-B2 · Aug 22, 2023 · US
Chip package structure, chip package system, and method of forming a chip package structure
US-2023064442-A1 · Mar 2, 2023 · US
Method of manufacturing a semiconductor package, die, and die package
US-2022230919-A1 · Jul 21, 2022 · US
Chip package and method of forming a chip package
US-2021375792-A1 · Dec 2, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/01 | 7 |
| H10W74/014 | 7 |
| H10W72/953 | 6 |
| H10W74/111 | 6 |
| H10W72/923 | 5 |