Printed circuit board and method of producing printed circuit board
US-12144111-B2 · Nov 12, 2024 · US
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Saito Hirokazu patents
Saito Hirokazu is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Saito Hirokazu |
| Total patents | 25 |
| First publication | Sep 3, 2015 |
| Latest publication | Nov 12, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Sensor device for welding
US-11717904-B2 · Aug 8, 2023 · US
Sensor device for welding
US-11577336-B2 · Feb 14, 2023 · US
Sensor device for welding
US-11491572-B2 · Nov 8, 2022 · US
Rejuvenation and/or extension of the lifetime of frictional performance in transmission fluids
US-11441094-B2 · Sep 13, 2022 · US
Printed circuit board and method of producing printed circuit board
US-2022225502-A1 · Jul 14, 2022 · US
Rejuvenation and/or extension of the lifetime of frictional performance in transmission fluids
US-2022106537-A1 · Apr 7, 2022 · US
Semiconductor device and semiconductor device manufacturing method
US-10714443-B2 · Jul 14, 2020 · US
Sensor device for welding
US-2020047274-A1 · Feb 13, 2020 · US
Sensor device for welding
US-2020016676-A1 · Jan 16, 2020 · US
Recent patents
Latest publications not already listed above.
Sensor device for welding
US-2020009675-A1 · Jan 9, 2020 · US
Vehicle lamp
US-10502388-B2 · Dec 10, 2019 · US
Vehicle lamp
US-2018372296-A1 · Dec 27, 2018 · US
Method of manufacturing semiconductor device
US-10121678-B2 · Nov 6, 2018 · US
Semiconductor device and semiconductor device manufacturing method
US-2018315726-A1 · Nov 1, 2018 · US
Semiconductor device and semiconductor device manufacturing method
US-10043773-B2 · Aug 7, 2018 · US
Camera device
US-10027861-B2 · Jul 17, 2018 · US
Method of manufacturing semiconductor device
US-2018061664-A1 · Mar 1, 2018 · US
Semiconductor device and semiconductor device manufacturing method
US-2018040579-A1 · Feb 8, 2018 · US
Semiconductor device and semiconductor device manufacturing method
US-9812417-B2 · Nov 7, 2017 · US
Camera device
US-2017257532-A1 · Sep 7, 2017 · US
Semiconductor device and semiconductor device manufacturing method
US-2017092610-A1 · Mar 30, 2017 · US
Wet friction clutch—lubricant systems providing high dynamic coefficients of friction through the use of borated detergents
US-9365794-B2 · Jun 14, 2016 · US
Solar-thermal collector
US-2015252792-A1 · Sep 10, 2015 · US
Solar-thermal collector
US-2015247490-A1 · Sep 3, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lapis Semiconductor Co Ltd | 6 |
| Daihen Corp | 6 |
| Kyocera Corp | 5 |
| Denso Corp | 4 |
| Jatco Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 6 |
| H10W72/942 | 6 |
| H10W72/952 | 6 |
| H10W72/923 | 6 |
| H10W72/019 | 6 |